Manufacturer Part #
D2516ECMDXGME-U
DRAM Chip DDR3/3L SDRAM 4Gbit 256M X 16 96-Ball FBGA
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| Mfr. Name: | Kingston | ||||||||||
| Standard Pkg: | Product Variant Information section Available PackagingPackage Qty:1 per Tray Package Style:FBGA-96 Mounting Method:Surface Mount | ||||||||||
| Date Code: | 2212 | ||||||||||
Product Specification Section
Kingston D2516ECMDXGME-U - Product Specification
Shipping Information:
Item cannot ship to certain countries. See List
Item cannot ship to following countries:
ECCN:
EAR99
PCN Information:
File
Date
NOTICE WITHDRAWAL
11/10/2021 Details and Download
ADVISORY
10/14/2021 Details and Download
Please note that Kingston Technology Company, Inc.'s (�KTC�) discrete ball grid array (BGA) DRAM products will be transitioning from KTC to Kingston Digital, Inc. (�KDI�). Effective January 1, 2022, all Kingston discrete BGA DRAM purchases shall be made under the KDI account (76007). Any orders placed after the date of this notice for shipment on or after January 1, 2022 shall be placed under the KDI account. The current list of Kingston discrete BGA DRAM solutions is attached. Please note this list is subject to change periodically
Part Status:
Active
Active
Kingston D2516ECMDXGME-U - Technical Attributes
Attributes Table
| Memory Type: | SDRAM |
| Memory Density: | 4Gb |
| Configuration: | 256 M x 16 |
| Supply Voltage-Nom: | 1.45V to 1.283V |
| CAS Latency: | 14 |
| Number of Words: | 256 M |
| Word Length: | 16b |
| Access Time-Max: | 20ns |
| Interface Type: | Parallel |
| Power Dissipation: | 1W |
| Operating Temp Range: | 0°C to 95°C |
| Storage Temperature Range: | -55°C to +100°C |
| Package Style: | FBGA-96 |
| Mounting Method: | Surface Mount |
Pricing Section
Global Stock:
4,170
USA:
4,170
On Order:
0
Factory Lead Time:
4 Weeks
Quantity
Web Price
1
$2.14
75
$2.11
100
$2.10
250
$2.07
375+
$2.04
Product Variant Information section
Available Packaging
Package Qty:
1 per Tray
Package Style:
FBGA-96
Mounting Method:
Surface Mount