Manufacturer Part #
Microchip has released a new Product Documents for the 24AA16/24LC16B/24FC16 16K I2C Serial EEPROM Data Sheet of devices.Notification Status: FinalDescription of Change: 1. Added 24FC16 and Q6B package Automotive product offerings2. Removed CSP product offering; Removed H-temp. offering from Automotive Product Identification System3. Updated DFN and SOT-23 package drawings.Impacts to Data Sheet: See above detailsReason for Change: To Improve ProductivityChange Implementation Status: CompleteDate Document Changes Effective: 31 August 2021NOTE: Please be advised that this is a change to the document only the product has not been changed.
Microchip has released a new Product Documents for the 24AA16/24LC16B/24FC16 Data Sheet of deviceDescription of Change: Replaced terminology Master and Slave with Host and Client respectively. Changed MUY with Q4B part number for UDFN package. Updated PDIP, SOIC, TSSOP and UDFN package drawings. Added Automotive Product Identification System. Reason for Change: To Improve Productivity Date Document Changes Effective: 17 Mar 2021NOTE: Please be advised that this is a change to the document only the product has not been changed.
Description of Change:Implement plastic box packing material for selected Microchip die sales products.Pre Change: Using paper box packing material.Post Change: Using plastic box packing material.Reason for Change:To improve manufacturability and productivity by using plastic box material.Estimated First Ship Date:September 13, 2019 (date code: 1937)