
Manufacturer Part #
93LC66BT-I/SN
93LC66 Series 4 Kbit (256 x 16) 5.5 V Microwire Compatible Serial EEPROM -SOIC-8
Product Specification
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Revision History:February 9, 2021: Issued final notification. Provided estimated first ship date to be February 19, 2021.March 22, 2021: Re-issued final notification. Attached the qualification report.Description of Change:Qualification of a new lead frame design for selected products available in 8L SOIC package using8390A die attach and gold (Au) bond wire material assembled at MMT assembly site.Pre Change:Using lead frame without lead lockPost Change:Using lead frame with lead lockReason for Change:To improve productivity by qualifying new lead frame designChange Implementation Status:In ProgressEstimated First Ship Date:February 19, 2021 (date code: 2108)
Description of Change:Qualification of a new lead frame design for selected products available in 8L SOIC package using 8390A die attach and palladium coated copper wire with gold flash (CuPdAu) bond wire material assembled at MMT assembly site.Pre Change:Using lead frame without lead lockPost Change:Using lead frame with lead lockReason for Change:To improve productivity by qualifying new lead frame design.Estimated Qualification Completion Date:March 2021
Description of Change:Qualification of a new lead frame design for selected products available in 8L SOIC package using 8390A die attach and gold (Au) bond wire material assembled at MMT assembly site.Pre Change:Using lead frame without lead lockPost Change:Using lead frame with lead lockReason for Change:To improve productivity by qualifying new lead frame designEstimated First Ship Date: February 19, 2021 (date code: 2108)
Part Status:
Technical Attributes
Memory Density: | 4kb |
Memory Organization: | 256 x 16 |
Supply Voltage-Nom: | 2.5V to 5.5V |
Clock Frequency-Max: | 2MHz |
Write Cycle Time-Max (tWC): | 6ms |
Package Style: | SOIC-8 |
Mounting Method: | Surface Mount |
Features & Applications
The 93XX66A/B/C devices are 4 Kbit low-voltage serial Electrically Erasable PROMs (EEPROM). Word-selectable devices such as the 93AA66C, 93LC66C or 93C66C are dependent upon external logic levels driving the ORG pin to set word size. For dedicated 8-bit communication, the 93XX66A devices are available, while the 93XX66B devices provide dedicated 16-bit communication.
Advanced CMOS technology makes these devices ideal for low-power, nonvolatile memory applications. The entire 93XX Series is available in standard packages including 8-lead PDIP and SOIC, and advanced packaging including 8-lead MSOP, 6-lead SOT-23, 8-lead 2x3 DFN and 8-lead TSSOP. All packages are Pb-free (Matte Tin) finish.
Features:
- Low-Power CMOS Technology
- ORG Pin to Select Word Size for ‘66C’ Version
- 512 x 8-bit Organization ‘A’ Devices (no ORG)
- 256 x 16-bit organization ‘B’ Devices (no ORG)
- Self-tImed Erase/Write Cycles (including Auto-Erase)
- Automatic Erase All (ERAL) Before Write All (WRAL)
- Power-On/Off Data Protection Circuitry
- Industry Standard 3-Wire Serial I/O
- Device Status Signal (Ready/Busy)
- Sequential Read Function
- 1,000,000 Erase/Write Cycles
- Data Retention > 200 Years
- Temperature ranges supported:
Available Packaging
Package Qty:
3300 per
Package Style:
SOIC-8
Mounting Method:
Surface Mount