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Manufacturer Part #
AT28HC256-12SU
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| Mfr. Name: | Microchip | ||||||||||
| Standard Pkg: | Product Variant Information section Available PackagingPackage Qty:27 per Tube | ||||||||||
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Product Specification
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Revision History:June 23, 2020: Issued initial notification.January 22, 2021: Issued final notification.February 09, 2021: Re-issued final notification. Corrected the Pre and Post Change section to match the Pre and Post Change table.Description of Change: Qualification of GTK as a new assembly site for selected Atmel products available in 28L SOIC (.300in) package.Pre Change: Assembled at LPI using CRM-1033BF die attach material with MSL 2 classification.Post Change: Assembled at GTK using EN-4900GC die attach material with MSL 3 classification.Reason for Change:To improve on-time delivery performance by qualifying GTK as a new assembly site.Earliest Implementation Date: February 25, 2021 (Date code: 2109)
Revision History:June 23, 2020: Issued initial notification.January 22, 2020: Issued final notification.Description of Change:Qualification of GTK as a new assembly site for selected Atmel products available in 28L SOIC (.300in) package.Pre Change:Assembled at LPI using CRM-1033BF die attach, QI-4939 die coat and G600 molding compound material.Post Change:Assembled at GTK using EN-4900GC die attach, PIX-8144 die coat and G631M molding compound materialReason for Change:To improve on-time delivery performance by qualifying GTK as a new assembly siteEarliest Implementation Date:February 25, 2021 (Date code: 2109)
Microchip has released a new Product Documents for the AT28HC256 Industrial Grade 256-Kbit (32,768 x 8) High-Speed Parallel EEPROM of devices.Description of Change:1) Updated to the Microchip template.2) Microchip DS20006428 replaces Atmel document 00073) Added updated Part Markings to include new trace code format. Reason for Change: To Improve ManufacturabilityChange Implementation Status: Complete
Description of Change: Qualification of GTK as a new assembly site for selected Atmel products available in 28L SOIC (.300in) package.Pre Change: Assembled at LPI using CRM-1033BF die attach, QI-4939 die coat and G600 molding compound material Post Change: Assembled at GTK using EN-4900GC die attach, PIX-8144 die coat and G631M molding compound materialReason for Change:To improve on-time delivery performance by qualifying GTK as a new assembly site Estimated Qualification Completion Date:November 2020
Part Status:
Available Packaging
Package Qty:
27 per Tube