Manufacturer Part #
Data Sheet - AT28HC256 - Complete DatasheetMicrochip has released a new Product Documents for the AT28HC256 - Complete Datasheet of devices.Notification Status: FinalDescription of Change: 1) Updated to the Microchip template. Microchip DS20006352 replaces Atmel document 0006. Added updated Part Markings to include new trace code formatImpacts to Data Sheet: NoneReason for Change: To Improve ManufacturabilityChange Implementation Status: CompleteDate Document Changes Effective: 13 May 2020NOTE: Please be advised that this is a change to the document only the product has not been changed.Markings to Distinguish Revised from Unrevised Devices: N/A
Revision History:January 10, 2014: Issued EOL notification.May 29, 2017: Issued cancellation notice for EOL of AT28 Series Parallel EEPROM (256k and 1Mb) Military grade devices in the CerDIP packages only.September 27, 2017: Re-issued the cancellation notice to attach the affected parts list.Description of Change:This original notification was issued to announce the EOL the AT28 Series Parallel EEPROM (256k and 1Mb) Military grade devices in the CerDIP packages only.Reason for Change:Microchip has decided to continue the production on the affected CPN.
PCN Status: Final notification.Description of Change:Qualification of MTAI as an additional assembly site for selected Atmel products available in 32L VQFN (5x5x0.9mm) package using palladium coated copper wire with gold flash (CuPdAu) bond wire.Pre Change: Assembled at NSEB Assembly site using gold (Au) bond wire, 8600 die attach material, and G770HCD molding compound materialReason for Change:To improve productivity by qualifying MTAI assembly site using palladium coated copper wire with gold flash (CuPdAu) bond wires.Estimated First Ship Date: October 20, 2017 (date code: 1742)