
Manufacturer Part #
CY15B104QSN-108SXI
CY15B104QSN Series 4 Mb (512 K x 8 ) 3.6 V Excelon™ Quad SPI F-RAM - SOIC-8
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Mfr. Name: | Cypress | ||||||||||
Standard Pkg: | Product Variant Information section Available PackagingPackage Qty:188 per Tray Package Style:SOIC-8 Mounting Method:Surface Mount | ||||||||||
Date Code: | 2025 |
Product Specification
Shipping Information:
ECCN:
PCN Information:
Addendum to PIN195102 - Manufacturing Label and Packing Configuration Standardization Description of Change: The purpose of this addendum is to correct the date from January 20, 2019 to January 20, 2020, in the "3rd paragraph in the 'Description of Change' section. This notification is to inform customers that Cypress will be standardizing its manufacturing labels and tray/tube packing configuration. It may be recalled that the Cypress entity consolidation (following the merger with Spansion Corp) was announced via Product Information Notification PIN174801 in November 2017. As the next phase of the entity consolidation process, Cypress will be adapting a new manufacturing label format for all products and revising shipping configurations for select product shipped in trays and tubes.
Product Lifecycle:
Technical Attributes
FRAM Type: | Integrated FRAM |
Memory Density: | 4Mb |
Interface Type: | SPI |
Memory Organization: | 512 K x 8 |
Supply Voltage-Nom: | 1.8V to 3.6V |
Temperature Range: | -40°C to +85°C |
Package Style: | SOIC-8 |
Mounting Method: | Surface Mount |
Features & Applications
Excelon™, Cypress’ next-generation Ferroelectric RAM (F-RAM), delivers the industry’s lowest-power mission-critical nonvolatile memory, by combining ultra-low-power operation with high-speed interfaces, instant nonvolatility and unlimited read/write cycle endurance. This makes Excelon the ideal data-logging memory for portable medical, wearable, IoT sensor, industrial and automotive applications.
Highlights
• Up-to 150x reduction in typical standby current (1 μA) and hibernate current (0.1 μA) compared
to current F-RAMs.
• Greater than 10x increase in performance with the addition of a 108 MHz QSPI, compared to
competing SPI F-RAMs.
• Offers NoDelay™ writes to capture data instantly with no soak time requirement and without any
additional components for power back-up.
• 2-Mbit, 4-Mbit, and 8-Mbit density options.
• Operating voltage range: 1.71–1.89V and 1.80–3.60V.
• Commercial (0°C to +70°C), Industrial (-40°C to +85°C), Auto-A (-40°C to +85°C) and Auto-E
(-40°C to +125°C) temperature grades.
Excelon LP for Portable Medical, Wearable, and IoT Devices
• Provides multiple power-saving modes, including hibernate, deep power-down and standby.
• Consumes 200x less energy than EEPROM and 3,000x less energy than NOR Flash products.
• Offers read/write endurance of 1,000 trillion write cycles to log data every millisecond for more
than 3,000 years.
• Introduces 8 Mbit density F-RAM, the highest-density Serial F-RAM, to meet the growing
data-logging requirement in these applications.
• Available in small footprint ~10mm2, 8-pin GQFN package.
Excelon Ultra for High-Performance Industrial Applications
• Provides a low-pin-count 108 MHz QSPI interface that is as fast as a parallel interface with 35 ns
burst access time.
• Offers read/write endurance of 100 trillion cycles to log data continuously for 15-20 years
at 85°C.
• Replaces a multi-component solution (SRAM + battery + power management controller) with a
single-chip solution and thereby improves reliability and reduces the BOM cost.
Excelon Auto for Automotive Applications
• AEC-Q100-qualified and Functional Safety (ISO 26262)-compliant memory.
• Offers read/write endurance of 10 trillion cycles to log data every 10 microseconds for 20 years.
• Replaces a multi-component solution (SRAM + battery + power management controller) with a
single-chip solution improve reliability and reduce the BOM cost.
Available Packaging
Package Qty:
188 per Tray
Package Style:
SOIC-8
Mounting Method:
Surface Mount