
Manufacturer Part #
25LC160B-I/P
EEPROM Memory IC 16Kb (2K x 8) SPI 10MHz 8-PDIP
Microchip 25LC160B-I/P - Product Specification
Shipping Information:
ECCN:
PCN Information:
Description of Change:Qualification of G600V as an additional/alternative mold compound material for selected products available in 40L, 8L,14L, 16L, 18L, 20L, 28L PDIP and 28L SPDIP packages at MMT assembly site using palladium coated copper wire with gold flash (CuPdAu) bond wire.Pre Change:Using GE800 mold compound material.Post Change:Using GE800 or G600V mold compound material.Reason for Change:To improve on time delivery performance by qualifying G600V as an addition/alternative mold compound material for selected PDIP and SPDIP packages at MMT assembly site. Because of factory shutdowns due to the COVID-19 pandemic, we must quickly implement this change or risk not having material to ship.Estimated First Ship Date:April 30, 2020 (date code: 2018)
Part Status:
Available Packaging
Package Qty:
60 per Tube