Manufacturer Part #
AT24C512C Series 512 kb 3.6 V Surface Mount I2C 2 Wire Serial EEPROM - TSSOP-8
|Standard Pkg:|| |
Product Variant Information section
5000 per Reel
PCN Status: Final notification.PCN Type:Manufacturing ChangeDescription of Change:Qualification of 66.88K process technology for selected Microchip products of the AT24C512C device familyImpacts to Data Sheet:NoneChange Impact:NoneReason for Change:To improve manufacturability by qualifying an additional fabrication site.Change Implementation Status:In ProgressEstimated First Ship Date:August 2, 2021 (date code: 2132)
Description of Change:1. Replaced terminology �Master� and �Slave� with �Host� and �Client�, respectively. Added note to Table 4-6 that explains the array architecture and how endurance is specified. Updated TSSOP and UDFN package drawings. Reason for Change: To Improve Productivity Date Document Changes Effective: 23 Apr 2021NOTE: Please be advised that this is a change to the document only the product has not been changed.
Microchip has released a new Product Documents for the AT24C512C - Complete Datasheet of devices.Description of Change:1) Revised Noise Suppression Time (tI) from 100 ns to 50 ns.2) Updated SOIC 8-Lead package drawing3) Minor text changes throughout.oneReason for Change: To Improve ManufacturabilityDate Document Changes Effective: 20 Mar 2020NOTE: Please be advised that this is a change to the document only the product has not been changed.
Description of Change:1) Updated to the Microchip template and Microchip DS20006161 replaces Atmel document 8720.2) Corrected tLOW typo from 400 ns to 500 ns and tAA typo from 550 ns to 450 ns.3) Deleted the AT24C512C?CUMHY?T package options.4) Updated Part Marking Information.5) Updated the “Software Reset” section. Added ESD rating.6) Removed lead finish designation.7) Updated trace code format in package markings.8) Updated section content throughout for clarification.9) Added a figure for “System Configuration Using Two?Wire Serial EEPROMs”.10) Added POR recommendations section.11) Updated the SOIC, SOIJ, TSSOP and UDFN package drawings to Microchip format.Reason for Change: To Improve ManufacturabilityDate Document Changes Effective: 07 Mar 2019.NOTE: Please be advised that this is a change to the document only the product has not been changed.
|Mounting Method:||Surface Mount|
5000 per Reel