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Manufacturer Part #
AT93C46EN-SH-T
AT93C46E Series 1 kB (64 x 16 ) 5.5 V SMT Micro Wire Serial EEPROM - SOIC-8
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| Mfr. Name: | Microchip | ||||||||||
| Standard Pkg: | Product Variant Information section Available PackagingPackage Qty:4000 per Reel Package Style:SOIC-8 Mounting Method:Surface Mount | ||||||||||
| Date Code: | |||||||||||
Product Specification
Shipping Information:
ECCN:
PCN Information:
Microchip has released a new Product Documents for the AT93C46D/AT93C46E Three-Wire Serial EEPROM Data Sheet of devices.Description of Change:1) Updated section content throughout for clarification. Updated test conditions values. Updated SOIC (SN) package drawing.Reason for Change: To Improve ManufacturabilityDate Document Changes Effective: 14 Feb 2020.NOTE: Please be advised that this is a change to the document only the product has not been changed.
AT93C46D/AT93C46E Three-Wire Serial EEPROM Data SheetMicrochip has released a new DeviceDoc for the AT93C46D/AT93C46E Three-Wire Serial EEPROM Data Sheet of devicesDescription of Change: 1. Updated to the Microchip template. 2. Microchip DS20006224 replaces Atmel documents 5193 and 5207. 3. Updated Package Marking Information. 4. Removed lead finish designation. 5. Updated trace code format in package markings.6. Updated section content throughout for clarification. 7. Updated the 8U3-1 VFBGA package drawing.8. Updated the PDIP, SOIC, TSSOP and UDFN package drawings to Microchip formatReason for Change: To Improve ManufacturabilityPlease be advised that this is a change to the document only the product has not been changed
CCB 2953 Final Notice: Qualification of matte tin lead finish for selected Atmel products available PCN Status: Final notificationPCN Type: Manufacturing ChangeDescription of Change: Qualification of matte tin lead finish for selected Atmel products available in 8L SOIC at ASSH Assembly site.Pre Change: Assembled at ANAP Assembly site using 8290 die attach material, and G700 molding compound material and NiPdAu lead finish or ASSH Assembly site using EN 4900G die attach material, G700 molding compound material and NiPdAu lead finish.Post Change: Assembled at ANAP Assembly site using 8290 die attach material, and G700 molding compound material and NiPdAu lead finish or ASSH Assembly site using EN 4900G die attach material, CEL-9240HF10AK molding compound material and Matte Tin lead finish.Reason for Change: To improve manufacturability by qualifying new bill of material for ASSH assembly site.Change Implementation Status: In ProgressEstimated First Ship Date: May 27, 2018 (date code: 1821)NOTE: Please be advised that after the estimated first ship date customers may receive pre and post change parts.
CCB 3369 Final Notice: Implement new carrier tape material with Microchip standard pocket size for selected Atmel products available in 8L SOIC package at ASSH assembly site PCN Status: Final notificationPCN Type: Manufacturing ChangeDescription of Change: Implement new carrier tape material with Microchip standard pocket size for selected Atmel products available in 8L SOIC package at ASSH assembly site. Pre Change: Carrier tape material with pocket size 6.9x5.4mm with supporting bar designPost Change: Carrier tape material with pocket size 6.4x5.2mm without supporting bar designImpacts to Data Sheet: NoneChange Impact: NoneReason for Change: To improve manufacturability by standardizing carrier tape material across all manufacturing locations. Other locations use either 6.4 or 6.5mm for dimension A0. Change Implementation Status: In ProgressEstimated First Ship Date: June 3, 2018 (date code: 1823)NOTE: Please be advised that after the estimated first ship date customers may receive pre and post change parts.Method to Identify Change: Traceability code
CCB 2953 Final Notice: Qualification of matte tin lead finish for selected Atmel products available in 8L SOIC at ASSH Assembly site.PCN Status: Final notificationPCN Type: Manufacturing ChangeDescription of Change: Qualification of matte tin lead finish for selected Atmel products available in 8L SOIC at ASSHASSEMBLY SITE:Pre Change:Assembled at ANAP Assembly site using 8290 die attach material, and G700 molding compoundmaterial and NiPdAu lead finish or ASSH Assembly site using EN 4900G die attach material,G700 molding compound material and NiPdAu lead finish.Post Change:Assembled at ANAP Assembly site using 8290 die attach material, and G700 molding compoundmaterial and NiPdAu lead finish or ASSH Assembly site using EN 4900G die attach material,CEL-9240HF10AK molding compound material and Matte Tin lead finishReason for Change: To improve manufacturability by qualifying new bill of material for ASSH assembly site.Change Implementation Status: In ProgressEstimated First Ship Date:May 27, 2018 (date code: 1821)NOTE: Please be advised that after the estimated first ship date customers may receive pre and post change parts.Method to Identify Change:Traceability codeQualification Report:Please open the attachments included with this PCN labeled as PCN_#_Qual ReportRevision History:June 15, 2017:Issued initial notification.June 20, 2017: Re-issued initial notification to include affected parts list and qualification plan.June 23, 2017:Re-issued initial notification to correct a typo on molding compound material from CEL-9240HF10AK and G700A/G700LS to G700.July 13, 2017:Re-issued initial notification to include ANAP Assembly site in the post change.April 27, 2018: Issued final notification. Attached the Qualification Report. Revised the affected parts list. Provided estimated first ship date on May 27, 2018.The change described in this PCN does not alter Microchip�s current regulatory complianceregarding the material content of the applicable products.
Product Lifecycle:
Technical Attributes
| Package Style: | SOIC-8 |
| Mounting Method: | Surface Mount |
Available Packaging
Package Qty:
4000 per Reel
Package Style:
SOIC-8
Mounting Method:
Surface Mount
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