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Manufacturer Part #
CY62148G-45SXI
CY62148G Series 4 Mb (512 K x 8) 4.5 to 5.5 V 55 ns SMT Static RAM - SOIC-32
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| Mfr. Name: | Cypress | ||||||||||
| Standard Pkg: | Product Variant Information section Available PackagingPackage Qty:125 per Tube Package Style:SOIC-32 Mounting Method:Surface Mount | ||||||||||
| Date Code: | 2025 | ||||||||||
Product Specification
Shipping Information:
ECCN:
PCN Information:
Qualification of Greatek Electronics Inc.as an Alternate Assembly Site for Select SOIC 32-Lead Package Description of Change: Cypress announced the qualification of Greatek Electronics Inc., Taiwan located at No. 136, Gong-Yi Rd., Zhunan Township, Miaoli County, Taiwan 350, as an alternate assembly site for select Memory and USB products offered in 32-Lead SOIC (450mil) package. These products are currently processed at Jiangsu Changjiang Electronics Technology Co., Ltd (JCET), Cypress' subcontractor in China. The transfer of assembly operations to Greatek is motivated by JCET's phasing out (i.e., End-Of-Life) of SOIC manufacturing operations, as previously announced in Advance PCN - APCN 201001. Given the imminent phase out of operations at JCET, and the dynamically changing market conditions, Cypress is pleased to offer supply of changed material (i.e., Greatek assembled product) ahead of the implementation date. Customers are strongly encouraged to avail of this option, where production volumes of Greatek assembled product can be secured and shipped against current orders. BOM Comparison: The SOIC 32L package will be assembled at Greatek using an industry standard set of Bill of Materials (BOM). Please see the table below for a comparison of BOM between Greatek and JCET. Benefit of Change: Qualification of alternative manufacturing sites provides the means for Cypress to ensure business continuity on the stated products, and thereby meet long-term market demand and delivery commitments to customers after the phase out of operations at JCET. Anticipated Impact: Products assembled at Greatek are completely compatible with existing products from form, fit, functional, parametric and quality performance perspectives. Cypress also recommends that customers take this opportunity to review this change against current application notes, system design considerations and customer environment conditions to assess impact (if any) to their application.
Subject: Planned Qualification of New Assembly, Test, and Finish Sites for Select RAM ProductsDescription of Change: Cypress is planning to qualify new sources of supply for select RAM products currently running at JCET (78 Changshan Rd, Jiangyin, Jiangsu, China 214400) and OSET (12-2 Nel Huan South Rd. N.E.P.Z. Kaohsiung, Taiwan 811, R.O.C.). The products will be qualified at the following sites already utilized by Cypress for similar packages: a. Greatek Taiwan for Assembly, Test, and Finish (No.136, Gon-Yi Rd. Zhunan Township, Miaoli County 350 Taiwan, R.O.C.) b. UTAC Thailand for Assembly, Test, and Finish (237 Lasalle Road, Sukhumvit 105 Bangna, Bangkok 10260 Thailand) c. Unimos China for Assembly (9688 Songze Ave., Qingpu Industrial Zone, Shanghai, China) d. KYEC Taiwan for Test and Finish (No. 81, Sec.2, Gongdaowu Rd., Hsin-Chu 300, Taiwan, R.O.C.) e. Cypress Philippines for Assembly, Test, and Finish (Gateway Business Park, SEPZA, Brgy., Javalera, General Trias, Cavite, Philippines) f. Cypress Bangkok for Assembly, Test, and Finish (229 Moo 4 Changwattana Road, Bangkok, Thailand) These sites are qualified to build standard and automotive grade products consistent with AEC-Q100/AEC-Q006 standards. Benefit of Change: Cypress will have the capability to meet market demand, and to ensure consistent and reliable delivery performance to customers. It is important, especially in the current pandemic situation, to establish alternate sources of supply. Qualification Status: Estimated dates for completion of the qualifications are provided in this notification. Document No. 001-53348 Rev.*H Page 3 of 3 Approximate Implementation Date: Estimated implementation dates are provided in this notification. Given the criticality of establishing alternate sources of supply, it is important that we enable these sources expeditiously. Anticipated Impact: No impact to form, fit and function is expected.
Addendum to PIN195102 - Manufacturing Label and Packing Configuration Standardization Description of Change: The purpose of this addendum is to correct the date from January 20, 2019 to January 20, 2020, in the "3rd paragraph in the 'Description of Change' section. This notification is to inform customers that Cypress will be standardizing its manufacturing labels and tray/tube packing configuration. It may be recalled that the Cypress entity consolidation (following the merger with Spansion Corp) was announced via Product Information Notification PIN174801 in November 2017. As the next phase of the entity consolidation process, Cypress will be adapting a new manufacturing label format for all products and revising shipping configurations for select product shipped in trays and tubes.
Product Lifecycle:
-
ROHS Compliant -
Lead Free
Technical Attributes
| Memory Density: | 4Mb |
| Memory Organization: | 512 K x 8 |
| Number of Words: | 512 K |
| Word Length: | 8b |
| Supply Voltage-Nom: | 4.5V to 5.5V |
| Access Time-Max: | 45ns |
| Temperature Grade: | Industrial |
| Data Bus Width: | 8b |
| Supply Current: | 20mA |
| Operating Temperature: | -40°C to +85°C |
| Storage Temperature Range: | -65°C to +150°C |
| Package Style: | SOIC-32 |
| Mounting Method: | Surface Mount |
Available Packaging
Package Qty:
125 per Tube
Package Style:
SOIC-32
Mounting Method:
Surface Mount
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