Manufacturer Part #
SRAM Chip Async Single 3V 8M-bit 512K x 16 55ns Automotive 48-Pin TSOP-I Tray
Introduction of ITW Meritex as a second source tray for 48-Lead TSOP package. The second source tray was designed to be compatible with the existing tray in terms of stackability and critical dimensions. Hence, both existing and second source tray will be used concurrently in production and allowed to be mixed in product box and shipment to customers. Reason: To reduce the risk of tray supply disruption. Hence, ensure continuous product delivery to customer. Description: Old First source tray Supplier: PEAKPocket Depth=2.00 � 0.10mm New Second source tray Supplier: ITW Meritex Pocket Depth=2.00 � 0.08mm Impact of change: No impact on electrical performance of the products as only a second source tray was introduced. Time schedule: Final qualification report: Available First samples available: Not applicable Intended start of delivery: 2022-02-08 or upon customer approval for PPAP part numbers
Description of Change: This notification is to inform customers that Cypress will be standardizing its Full Box Quantity to a sellable quantity in the market where it will be able to round the orders in increment of this full box quantity. It may be recalled that Cypress had implemented Manufacturing Label and Packing Configuration Standardization via Product Information Notification PIN195102 in December 2019. As part of the Cypress integration into Infineon Shipping Standard, Cypress will be adjusting Minimum Order Quantity (MOQ), Order Increment (OI) to align them with new Full Box Quantity for select parts shipped in trays and tubes.
Description of Change: Cypress announces the qualification of Cypress Bangkok (229 Moo 4 Changwattana Road, Pakkret, Nonthaburi 11120, Thailand) as an additional assembly site for select 48-Lead TSOP I, 18.4x12x1.2mm, Pb-Free products. Benefit of Change: Qualification of alternate manufacturing sites is part of the ongoing flexible manufacturing initiative announced by Cypress. The goal of the flexible manufacturing initiative is to provide the means for Cypress to continue to meet delivery commitments through dynamic, changing market conditions.
Subject: Planned Qualification of New Assembly Sites for Select Automotive RAM Products Description of Change: Cypress is planning to qualify new assembly sites for select Automotive RAM products currently running at JCET (78 Changshan Rd, Jiangyin, Jiangsu, China 214400) and OSET (12-2 Nel Huan South Rd. N.E.P.Z. Kaohsiung, Taiwan 811, R.O.C.). The products will be qualified at the following sites already utilized by Cypress for similar packages. a. Greatek Taiwan (No.136, Gon-Yi Rd. Zhunan Township, Miaoli County 350 Taiwan, R.O.C.) b. Cypress Bangkok (229 Moo 4 Changwattana Road Pakkred, Nonthaburi 11120 Thailand) Both sites are qualified to build automotive grade products consistent with AEC-Q100/AEC-Q006 standards. Refer to the table below for the qualification schedules, PCN publication dates, and estimated implementation dates. This is an advance notification and no immediate action is needed. Benefit of Change: Cypress will have the capability to meet market demand, and to ensure consistent and reliable delivery performance to customers. It is important, especially in the current pandemic situation, to establish alternate sources of supply. Qualification Status: Estimated dates for completion of the qualifications are provided in this notification. Approximate Implementation Date: Estimated implementation dates are provided in this notification. Given the criticality of establishing alternate sources of supply, it is important that we enable these sources expeditiously. Cypress will make every effort to further improve the qualification schedule; an updated notification will be sent if the schedule is accelerated. Anticipated Impact: No impact to form, fit and function is expected.
Addendum to PIN195102 - Manufacturing Label and Packing Configuration Standardization Description of Change: The purpose of this addendum is to correct the date from January 20, 2019 to January 20, 2020, in the "3rd paragraph in the 'Description of Change' section. This notification is to inform customers that Cypress will be standardizing its manufacturing labels and tray/tube packing configuration. It may be recalled that the Cypress entity consolidation (following the merger with Spansion Corp) was announced via Product Information Notification PIN174801 in November 2017. As the next phase of the entity consolidation process, Cypress will be adapting a new manufacturing label format for all products and revising shipping configurations for select product shipped in trays and tubes.
Planned Qualification of Spansion Manufacturing Sites for Cypress ProductsDescription of Change:In concert with the recently announced merger between Cypress Semiconductor Corporation (Cypress) and Spansion Inc. (Spansion), Cypress announces plans to qualify proprietary SONOS Technology products at Spansion Fab 25 / Test 25 in Austin, Texas and BGA/TSOP-packaged products at the Spansion assembly facility in Bangkok, Thailand. These qualifications and implementations are expected to occur throughout 2015 and 2016. Once complete, the qualifications will be announced through regular PCNs.This is an advance notification and no immediate action is needed. Refer to the attached Supplier documentation for the complete schedule of the activity, PCN issue dates and shipment start dates.