Manufacturer Part #
CY62167EV30 Series 16 Mb (1M x 16 / 2 M x 8) 3 V 45 ns Static RAM - FBGA-48
|Standard Pkg:|| |
Product Variant Information section
2000 per Reel
Addendum to PIN195102 - Manufacturing Label and Packing Configuration Standardization Description of Change: The purpose of this addendum is to correct the date from January 20, 2019 to January 20, 2020, in the "3rd paragraph in the 'Description of Change' section. This notification is to inform customers that Cypress will be standardizing its manufacturing labels and tray/tube packing configuration. It may be recalled that the Cypress entity consolidation (following the merger with Spansion Corp) was announced via Product Information Notification PIN174801 in November 2017. As the next phase of the entity consolidation process, Cypress will be adapting a new manufacturing label format for all products and revising shipping configurations for select product shipped in trays and tubes.
Description of Change: Cypress has qualified an EIA standard outline cover tape for all tape and reel shipment at Cypress Philippines (CML, Gateway Business Park, SEPZA, Brgy., Javalera, General Trias, Cavite, Philippines). The new cover tape meets the Cypress specification and demonstrates the same quality as the current cover tape.
Qualification of UMC as an Alternate Wafer Fab Site for Select 16Mb MoBL SRAM Products Description of Change: Cypress announces the qualification of UMC's 65nm (No. 3, Li-Hsin 2nd Rd., Hsinchu Science Park, Hsinchu, Taiwan, R.O.C.) as an alternate wafer fab site for select 16Mb Async MoBL SRAM products. The 65nm product is form, fit and function compatible with the 90nm 16Mb Async MoBL SRAM products manufactured at Skywater, Minnesota. There will be no change to the existing marketing part numbers.
Planned Qualification of Spansion Manufacturing Sites for Cypress ProductsDescription of Change:In concert with the recently announced merger between Cypress Semiconductor Corporation (Cypress) and Spansion Inc. (Spansion), Cypress announces plans to qualify proprietary SONOS Technology products at Spansion Fab 25 / Test 25 in Austin, Texas and BGA/TSOP-packaged products at the Spansion assembly facility in Bangkok, Thailand. These qualifications and implementations are expected to occur throughout 2015 and 2016. Once complete, the qualifications will be announced through regular PCNs.This is an advance notification and no immediate action is needed. Refer to the attached Supplier documentation for the complete schedule of the activity, PCN issue dates and shipment start dates.
|Memory Organization:||1 M x 16 / 2 M x 8|
|Supply Voltage-Nom:||2.2V to 3.6V|
|Mounting Method:||Surface Mount|
Features & Applications
This device features an advanced circuit design that provides an ultra low active current. Ultra low active current is ideal for providing More Battery Life (MoBL®) in portable applications such as cellular telephones.
- TSOP I package configurable as 1 M × 16 or 2 M × 8 SRAM
- Very high speed: 45 ns
- Temperature ranges
- Industrial: –40 °C to +85 °C
- Automotive-A: –40 °C to +85 °C
- Wide voltage range: 2.20 V to 3.60 V
- Ultra-low standby power
- Typical standby current: 1.5 µA
- Maximum standby current: 12 µA
- Ultra-low active power
- Typical active current: 2.2 mA at f = 1 MHz
- Easy memory expansion with CE1, CE2, and OE Features
- Automatic power-down when deselected
- CMOS for optimum speed and power
- Offered in Pb-free 48-ball VFBGA and 48-pin TSOP I packages
2000 per Reel