Manufacturer Part #
CY7C1018DV33 Series 1 Mb (128 K x 8) 3.3 V 10 ns Static RAM - SOJ-32
|Standard Pkg:|| |
Product Variant Information section
23 per Tube
Addendum to PCN 203103 - Transfer of Assembly Operations to Greatek Electronics Inc. for Select SOIC, SSOP and SOJ Packages Description of Change: The purpose of this addendum is to update JCET's BOM information as listed in BOM table below. There is no change to Greatek BOM and affected parts list. Cypress announced the qualification of Greatek Electronics Inc., Taiwan located at No. 136, Gong-Yi Rd., Zhunan Township, Miaoli County 350, Taiwan, as an alternate assembly site for select Memory and USB products offered in 32-Lead SOIC (450mil), 56-Lead SSOP (300mil) and 44-Lead SOJ (400mil), 36-Lead SOJ (400mil), 32-Lead SOJ (400mil), 32-Lead SOJ (300mil), 28-Lead SOJ (300mil) packages. These products are currently processed at Jiangsu Changjiang Electronics Technology Co., Ltd (JCET), Cypress' subcontractor in China. The transfer of assembly operations to Greatek is motivated by JCET's phasing out (i.e., End-Of-Life) of SOIC, SSOP and SOJ manufacturing operations, as previously announced in advance PCN (APCN 201001 and APCN 201002). Benefit of Change: Qualification of alternative manufacturing sites provides the means for Cypress to ensure business continuity on the stated products, and thereby meet long-term market demand and delivery commitments to customers after the phase out of operations at JCET.
Transfer of Assembly Operations to Greatek Electronics Inc. for Select SOIC, SSOP and SOJ Packages Description of Change: Cypress announces the qualification of Greatek Electronics Inc., Taiwan located at No. 136, Gong-Yi Rd., Zhunan Township, Miaoli County 350, Taiwan, as an alternate assembly site for select Memory and USB products offered in 32-Lead SOIC (450mil), 56-Lead SSOP (300mil) and 44-Lead SOJ (400mil), 36-Lead SOJ (400mil), 32-Lead SOJ (400mil), 32-Lead SOJ (300mil), 28-Lead SOJ (300mil) packages. These products are currently processed at Jiangsu Changjiang Electronics Technology Co., Ltd (JCET), Cypress' subcontractor in China. The transfer of assembly operations to Greatek is motivated by JCET's phasing out (i.e., End-Of-Life) of SOIC, SSOP and SOJ manufacturing operations, as previously announced in advance PCN (APCN 201001 and APCN 201002). Given the imminent phase out of operations at JCET, and the dynamically changing market conditions, Cypress is pleased to offer supply of changed material (i.e., Greatek assembled product) ahead of the implementation date. Customers are strongly encouraged to avail of this option, where production volumes of Greatek assembled product can be secured and shipped against current orders. Please contact your Cypress Sales Representative for more information on availing this option.
Subject: Planned Qualification of New Assembly, Test, and Finish Sites for Select RAM ProductsDescription of Change: Cypress is planning to qualify new sources of supply for select RAM products currently running at JCET (78 Changshan Rd, Jiangyin, Jiangsu, China 214400) and OSET (12-2 Nel Huan South Rd. N.E.P.Z. Kaohsiung, Taiwan 811, R.O.C.). The products will be qualified at the following sites already utilized by Cypress for similar packages: a. Greatek Taiwan for Assembly, Test, and Finish (No.136, Gon-Yi Rd. Zhunan Township, Miaoli County 350 Taiwan, R.O.C.) b. UTAC Thailand for Assembly, Test, and Finish (237 Lasalle Road, Sukhumvit 105 Bangna, Bangkok 10260 Thailand) c. Unimos China for Assembly (9688 Songze Ave., Qingpu Industrial Zone, Shanghai, China) d. KYEC Taiwan for Test and Finish (No. 81, Sec.2, Gongdaowu Rd., Hsin-Chu 300, Taiwan, R.O.C.) e. Cypress Philippines for Assembly, Test, and Finish (Gateway Business Park, SEPZA, Brgy., Javalera, General Trias, Cavite, Philippines) f. Cypress Bangkok for Assembly, Test, and Finish (229 Moo 4 Changwattana Road, Bangkok, Thailand) These sites are qualified to build standard and automotive grade products consistent with AEC-Q100/AEC-Q006 standards. Benefit of Change: Cypress will have the capability to meet market demand, and to ensure consistent and reliable delivery performance to customers. It is important, especially in the current pandemic situation, to establish alternate sources of supply. Qualification Status: Estimated dates for completion of the qualifications are provided in this notification. Document No. 001-53348 Rev.*H Page 3 of 3 Approximate Implementation Date: Estimated implementation dates are provided in this notification. Given the criticality of establishing alternate sources of supply, it is important that we enable these sources expeditiously. Anticipated Impact: No impact to form, fit and function is expected.
Addendum to PIN195102 - Manufacturing Label and Packing Configuration Standardization Description of Change: The purpose of this addendum is to correct the date from January 20, 2019 to January 20, 2020, in the "3rd paragraph in the 'Description of Change' section. This notification is to inform customers that Cypress will be standardizing its manufacturing labels and tray/tube packing configuration. It may be recalled that the Cypress entity consolidation (following the merger with Spansion Corp) was announced via Product Information Notification PIN174801 in November 2017. As the next phase of the entity consolidation process, Cypress will be adapting a new manufacturing label format for all products and revising shipping configurations for select product shipped in trays and tubes.
Qualification of OSE-T as an Additional Assembly Site for Select Pb-Free ProductsDescription of Change: Cypress announces the qualification of Orient Semiconductor Electronics, Taiwan (OSE-T) as an additional assembly site for select commercial and industrial grade products. These products are RoHS and REACH compliant. Benefit of Change: Qualification of alternate manufacturing sites is part of the ongoing flexible manufacturing initiative announced by Cypress. The goal of the flexible manufacturing initiative is to provide the means for Cypress to continue to meet delivery commitments through dynamic, changing market conditions. Approximate Implementation Date: Effective 90 days from the date of this notification or upon customer approval, whichever comes first, all shipments of Commercial and Industrial non-PPAP part numbers in the attached file will be assembled at OSE-T or other approved assembly sites. Anticipated Impact: Products assembled at the new site are completely compatible with existing products from form, fit, functional, parametric and quality performance perspectives. Cypress also recommends that customers take this opportunity to review these changes against current application notes, system design considerations and customer environment conditions to assess impact (if any) to their application.
|Memory Organization:||128 K x 8|
|Mounting Method:||Surface Mount|
Features & Applications
The CY7C1011DV33 is available in standard Pb-free 44-pin TSOP II with center power and ground pinout, as well as 48-ball very fine-pitch ball grid array (VFBGA) packages.
- Pin-and function-compatible with CY7C1011CV33
- High speed
- tAA = 10 ns
- Low active power
- ICC = 90 mA @ 10 ns (Industrial)
- Low CMOS standby power
- ISB2 = 10 mA
- Data Retention at 2.0 V
- Automatic power-down when deselected
- Independent control of upper and lower bits
- Easy memory expansion with CE and OE features
- Available in Pb-free 44-pin TSOP II, and 48-ball VFBGA
23 per Tube