Manufacturer Part #
S29GL128P Series 128 Mb (16M x 8) 3 V 110 ns SMT Flash-NOR Memory - BGA-64
|Standard Pkg:|| |
Product Variant Information section
180 per Tray
Description of Change: This notification is to inform customers that Cypress will be standardizing its Full Box Quantity to a sellable quantity in the market where it will be able to round the orders in increment of this full box quantity. It may be recalled that Cypress had implemented Manufacturing Label and Packing Configuration Standardization via Product Information Notification PIN195102 in December 2019. As part of the Cypress integration into Infineon Shipping Standard, Cypress will be adjusting Minimum Order Quantity (MOQ), Order Increment (OI) to align them with new Full Box Quantity for select parts shipped in trays and tubes.
Qualification of Copper Palladium Gold Wire (CuPdAu) and Shinetsu KMC3580LVA Mold Compound for FBGA Packages Assembled at Cypress Bangkok Description of Change: Cypress announces the qualification of Copper Palladium Gold (CuPdAu) wire and Shinetsu KMC3580LVA mold compound for FBGA packages assembled at Cypress Bangkok. This new bond wire type is consistent with industry standards per AEC-Q006 requirements. This mold compound is consistent with Cypress' drive to Green and Pb-free RoHS compliant packages. In addition, this Green and Pb-free (Shinetsu KMC3580LVA) mold compound is compatible with industry standard reflow temperatures for applicable package volume, thickness and lead finish.
|Supply Voltage-Nom:||2.7V to 3.6V|
|Mounting Method:||Surface Mount|
180 per Tray