Manufacturer Part #
FL-S SPI Series 256 Mb (32 M x 8) 3.6 V 133 MHz Flash Memory - BGA-24
|Standard Pkg:|| |
Product Variant Information section
338 per Tray
Description of Change: This notification is to inform customers that Cypress will be standardizing its Full Box Quantity to a sellable quantity in the market where it will be able to round the orders in increment of this full box quantity. It may be recalled that Cypress had implemented Manufacturing Label and Packing Configuration Standardization via Product Information Notification PIN195102 in December 2019. As part of the Cypress integration into Infineon Shipping Standard, Cypress will be adjusting Minimum Order Quantity (MOQ), Order Increment (OI) to align them with new Full Box Quantity for select parts shipped in trays and tubes.
Qualification of Amkor Assembly & Test (Shanghai) Co., Ltd. as an Additional Backend Test Site for Select Memory Solutions NOR Flash Products Description of Change: Cypress announces the qualification of Amkor Assembly & Test (Shanghai) Co., Ltd. (No. 111 Yinglun Road, WaiGaoQiao, Free Trade Zone, Shanghai, China) as an additional backend test site for select Memory Solutions NOR Flash products. These products are currently being tested on the Teradyne Magnum test platform at Cypress Semiconductor (Thailand) Limited in Bangkok, Thailand and are now qualified on a similar test platform at Amkor Assembly & Test. There are no changes to the test coverage and methodology.
|Program Memory Type:||Flash|
|InterfaceType / Connectivity:||SPI|
|Memory Organization:||32 M x 8|
|Supply Voltage-Nom:||2.7V to 3.6V|
|Operating Temp Range:||-40°C to +105°C|
|Storage Temperature Range:||-65°C to +150°C|
|Moisture Sensitivity Level:||3|
|Mounting Method:||Surface Mount|
338 per Tray