
Manufacturer Part #
DSPIC30F2020-20E/SO
dsPIC30F Series 512 B RAM 12 kB Flash 16-Bit Digital Signal Controller - SOIC-28
Product Specification
Shipping Information:
ECCN:
PCN Information:
Notification subject: CCB 3217 and CCB 3217.001 Final Notice: Qualification of palladium coated copper with gold flash (CuPdAu) bond wire in selected products available in 18L and 28L SOIC package at MTAI assembly sitePCN Status:Final notificationPCN Type: Manufacturing ChangeDescription of Change: Qualification of palladium coated copper with gold flash (CuPdAu) bond wire in selected products available in 18L and 28L SOIC package at MTAI assembly sitePre Change: Using palladium coated copper wire (PdCu) bond wirePost Change: Using palladium coated copper with gold flash (CuPdAu) bond wireImpacts to Data Sheet: NoneChange Impact: NoneReason for Change: To improve productivity by qualifying palladium coated copper with gold flash (CuPdAu) bond wireChange Implementation Status: In ProgressEstimated First Ship Date: September 16, 2018 (date code: 1838)NOTE: Please be advised that after the estimated first ship date customers may receive pre and post change parts.Method to Identify Change: Traceability codeRevision History: March 08, 2018: Issued initial notification.August 16, 2018: Issued final notification. Attached the Qualification Report. Revised the affected parts list. Provided estimated first ship date on September 16, 2018. The change described in this PCN does not alter Microchip's
Description of Change:Qualification of palladium coated copper with gold flash (CuPdAu) bond wire in selected products available in 18L and 28L SOIC package at MTAI assembly site.Pre Change: Using palladium coated copper wire (PdCu) bond wire.Post Change:Using palladium coated copper with gold flash (CuPdAu) bond wireReason for Change:To improve productivity by qualifying palladium coated copper with gold flash (CuPdAu) bond wire Estimated Qualification Completion Date:April 2018
Part Status:
Technical Attributes
Family Name: | dsPIC30F |
Core Processor: | dsPIC |
Program Memory Type: | Flash |
Flash Size (Bytes): | 12kB |
RAM Size: | 512B |
Speed: | 15MHz |
No of I/O Lines: | 21 |
InterfaceType / Connectivity: | I2C/SPI/UART |
Peripherals: | Analog Comparators/I2C/On-Chip-ADC/PWM/SPI/UART/Watchdog |
Number Of Timers: | 3 |
Supply Voltage: | 3V to 5.5V |
Operating Temperature: | -40°C to +125°C |
On-Chip ADC: | 8-chx10-bit |
Watchdog Timers: | 1 |
Package Style: | SOIC-28 |
Mounting Method: | Surface Mount |
Features & Applications
The DSPIC30F2020-20E/SO is a high-performance switch mode power supply digital signal controller with an operating voltage range of 2.5 to 5.5 V and having program memory of 12 kB, available in SOIC-28 package.
Features:
- High-Performance Modified RISC CPU:
- Modified Harvard architecture.
- C compiler optimized instruction set architecture.
- 83 base instructions with flexible addressing modes.
- 24-bit wide instructions, 16-bit wide data path.
- 12 Kbytes on-chip Flash program space.
- 512 bytes on-chip data RAM.
- 16 x 16-bit working register array.
- Up to 30 MIPs operation.
- 32 interrupt sources.
- Three external interrupt sources.
- 8 user-selectable priority levels for each interrupt.
- 4 processor exceptions and software trap.
- DSP Engine Features:
- Modulo and Bit-Reversed modes.
- Two 40-bit wide accumulators with optional saturation logic.
- 17-bit x 17-bit single-cycle hardware fractional/integer multiplier.
- Single-cycle Multiply-Accumulate (MAC) operation.
- 40-stage Barrel Shifter.
- Dual data fetch.
Applications:
- AC to DC Converters.
- DC to DC Converters.
- Power Factor Correction (PFC).
- Uninterruptible power supply (UPS).
- Inverters.
- Embedded Power-Supply Controllers.
- Circuit Breakers, Arc Fault Detection.
- Digital Lighting.
Available Packaging
Package Qty:
27 per Tube
Package Style:
SOIC-28
Mounting Method:
Surface Mount