Manufacturer Part #
Cortex M0,PSOC 4, 48MHz, FLASH 32KB,40-QFN
Addendum to PIN195102 - Manufacturing Label and Packing Configuration Standardization Description of Change: The purpose of this addendum is to correct the date from January 20, 2019 to January 20, 2020, in the "3rd paragraph in the 'Description of Change' section. This notification is to inform customers that Cypress will be standardizing its manufacturing labels and tray/tube packing configuration. It may be recalled that the Cypress entity consolidation (following the merger with Spansion Corp) was announced via Product Information Notification PIN174801 in November 2017. As the next phase of the entity consolidation process, Cypress will be adapting a new manufacturing label format for all products and revising shipping configurations for select product shipped in trays and tubes.
Description of Change: Cypress has qualified an EIA standard carrier tape for select QFN packages at Cypress Philippines (CML, Gateway Business Park, SEPZA, Brgy., Javalera, General Trias, Cavite, Philippines). The new carrier tape meets the Cypress specification and demonstrates the same quality as the current carrier tape being used. Benefit of Change: This change is part of Cypress' continuous quality improvement to standardize tape and reel materials at Cypress Philippines.
Description of Change: Cypress has qualified an EIA standard outline cover tape for all tape and reel shipment at Cypress Philippines (CML, Gateway Business Park, SEPZA, Brgy., Javalera, General Trias, Cavite, Philippines). The new cover tape meets the Cypress specification and demonstrates the same quality as the current cover tape.
Qualification of Fab 25 with the Copper (Cu) BEOL Process and Test 25 as an Additional Wafer Sort Site for the PSoC� 4200 Product Family Description of Change: Cypress announces the qualification of Fab 25 (5204 East Ben White Boulevard, Austin, TX 78741, USA) with the Copper (Cu) Backend of Line (BEOL) process and Test 25 (5204 East Ben White Boulevard, Austin, TX 78741, USA) as an additional wafer sort site for the PSoC� 4200 product family. The Aluminum (Al) BEOL process uses Tungsten (W) plugs and Ti/TiN/Al metallization with subtractive patterning to create the metal interconnect layers. The Cu BEOL process converts the underlying metal interconnect layers from W plugs to Cu plugs and from Ti/TiN/Al metallization with subtractive patterning to Cu damascene with Ta/TaN barriers. This qualification is part of the flexible manufacturing initiatives which allow Cypress to meet its delivery commitments in dynamic and changing market conditions.