Manufacturer Part #
CY8C4xx Series 64 kB Flash 8 kB RAM 48 MHz SMT 32-Bit PSoC®4 - TQFP-48
|Standard Pkg:|| |
Product Variant Information section
250 per Tray
Description of Change: The purpose of this notification is to inform customers that a PSoC Creator and/or CyBoot update is required for PSoC 4200L products using the USB component. Select manufacturing lots will fail 100% when used with older PSoC Creator and/or CyBoot component versions. The units will fail to enumerate using USB or show excessive IMO clock error. All customers must upgrade to CyBoot component V5.81 only available in PSoC Creator V4.2 or CyBoot component V6.0 only available in PSoC Creator V4.3. Both versions of CyBoot will be available on cypress.com by September 23, 2020.
Subject: Qualification of Greatek Electronic as an Additional Assembly, Test and Finish Sites for Select 48-Lead TQFP Pb-Free Products Description of Change: Cypress announces the qualification of Greatek Electronics Inc. (Greatek, No. 136, Gong-Yi Rd., Zhunan Township, Miaoli County 350, Taiwan.) as an additional assembly, test and finish sites for select 48-Lead TQFP Pd-Free (7.00x7.00x1.40mm) products.Benefit of Change: Qualification of alternate manufacturing sites is part of the ongoing flexible manufacturing initiative announced by Cypress. The goal of the flexible manufacturing initiative is to provide the means for Cypress to continue to meet delivery commitments through dynamic, changing market conditions. Approximate Implementation Date: Effective 90 days from the date of this notification or upon customer approval, whichever comes first, all shipments of Commercial, Industrial and Automotive non-PPAP part numbers in the attached file will be assembled at Greatek Electronics or other approved assembly sites. Anticipated Impact: Products assembled at the new site are completely compatible with existing products from form, fit, functional, parametric and quality performance perspectives. Cypress also recommends that customers take this opportunity to review these changes against current application notes, system design considerations and customer environment conditions to assess impact (if any) to their application.
Addendum to PIN195102 - Manufacturing Label and Packing Configuration Standardization Description of Change: The purpose of this addendum is to correct the date from January 20, 2019 to January 20, 2020, in the "3rd paragraph in the 'Description of Change' section. This notification is to inform customers that Cypress will be standardizing its manufacturing labels and tray/tube packing configuration. It may be recalled that the Cypress entity consolidation (following the merger with Spansion Corp) was announced via Product Information Notification PIN174801 in November 2017. As the next phase of the entity consolidation process, Cypress will be adapting a new manufacturing label format for all products and revising shipping configurations for select product shipped in trays and tubes.
Qualification of Fab 25 with the Copper (Cu) BEOL Process and Test 25 as an Additional Sort Site for the PSoC� 4200L Product Family Description of Change: The Aluminum (Al) BEOL process uses Tungsten (W) plugs and Ti/TiN/Al metallization with subtractive patterning to create the metal interconnect layers. The Cu BEOL process converts the underlying metal interconnect layers from W plugs to Cu plugs and from Ti/TiN/Al metallization with subtractive patterning to Cu damascene with Ta/TaN barriers. These qualifications are part of the flexible manufacturing initiatives which allow Cypress to meet its delivery commitments in dynamic and changing market conditions. Benefit of Change: Qualification of alternate manufacturing processes is part of the ongoing flexible manufacturing initiative announced by Cypress. The goal of the flexible manufacturing initiative is to provide the means for Cypress to continue to meet delivery commitments through dynamic, changing market conditions.
|Core Processor:||ARM Cortex M0|
|Program Memory Type:||Flash|
|Flash Size (Bytes):||64kB|
|No of I/O Lines:||38|
|InterfaceType / Connectivity:||IrDA/I2C/LINbus/Microwire/SmartCard/SPI/SSP/UART/USART/USB|
|Supply Voltage:||1.71V to 5.5V|
|Operating Temperature:||-40°C to +85°C|
|Mounting Method:||Surface Mount|
250 per Tray