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Manufacturer Part #


LPC17xx Series 512 kB Flash 64 kB RAM SMT 32-Bit-Microcontroller - LQFP-100

Mfr. Name: NXP
Standard Pkg:
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Product Specification Section
Technical Attributes
Attributes Table
Family Name: LPC17xx
Core Processor: ARM Cortex M3
Program Memory Type: Flash
Flash Size (Bytes): 512kB
RAM Size: 64kB
Speed: 120MHz
No of I/O Lines: 70
InterfaceType / Connectivity: CAN/Ethernet/I2C/I2S/SPI/SSP/UART/USB
Peripherals: CAN/Ethernet/I2C/I2S/On-Chip-ADC/PWM/SPI/SSP/UART/USB/Watchdog
Number Of Timers: 4
Supply Voltage: 2.4V to 3.6V
Operating Temperature: -40°C to +85°C
On-Chip ADC: 8-chx12-bit
Watchdog Timers: 1
Package Style:  LQFP-100
Mounting Method: Surface Mount
Features & Applications

The LPC1769 are ARM Cortex-M3 based microcontrollers for embedded applications featuring a high level of integration and low power consumption. The ARM Cortex-M3 is a next generation core that offers system enhancements such as enhanced debug features and a higher level of support block integration.

The LPC1769 operates at CPU frequencies of up to 120 MHz. The ARM Cortex-M3 CPU incorporates a 3-stage pipeline and uses a Harvard architecture with separate local instruction and data buses as well as a third bus for peripherals. The ARM Cortex-M3 CPU also includes an internal prefetch unit that supports speculative branching.


  • ARM Cortex-M3 processor, running at frequencies of up to 100 MHz. A Memory Protection Unit (MPU) supporting eight regions is included
  • ARM Cortex-M3 built-in Nested Vectored Interrupt Controller (NVIC)
  • Up to 512 kB on-chip flash programming memory. Enhanced flash memory accelerator enables high-speed 100 MHz operation with zero wait states
  • In-System Programming (ISP) and In-Application Programming (IAP) via on-chip bootloader software
  • On-chip SRAM includes
  • Eight channel General Purpose DMA controller (GPDMA) on the AHB multilayer matrix that can be used with SSP, I2S-bus, UART, Analog-to-Digital and Digital-to-Analog converter peripherals, timer match signals, and for memory-to-memory transfers
  • Multilayer AHB matrix interconnect provides a separate bus for each AHB master. AHB masters include the CPU, General Purpose DMA controller, Ethernet MAC, and the USB interface. This interconnect provides communication with no arbitration delays
  • Split APB bus allows high throughput with few stalls between the CPU and DMA
  • Serial interfaces
  • Standard JTAG test/debug interface for compatibility with existing tools. Serial Wire Debug and Serial Wire Trace Port options
  • Available as 100-pin LQFP package (14 × 14 × 1.4 mm)


  • eMetering
  • Alarm systems
  • Lighting
  • White goods
  • Industrial networking
  • Motor control
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Factory Lead Time:
26 Weeks
Web Price
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