Manufacturer Part #
|Mfr. Name:||Lattice Semiconductor|
Notification of Removal of Device Backside Mark on all Lattice QFP Products Lattice is providing this notification of our intent to remove the backside marking for Lattice Quad Flat Pack (QFP) products. The backside marking removal will be a gradual transition until existing inventories have been exhausted. The manufacturing process will be changed on or after December 28, 2020 and the realization of the removal by the customer will be a gradual transition over time, depending on the individual products' inventory levels. Backside marking consists of the Date Code (YYWW) and Assembly Lot number. These are both being marked in package assembly. Currently, backside marking is utilized only for internal traceability. The device and assembly lot will maintain traceability with the Inspection Lot (topside lot number). The change is aimed to standardize with current industry practices.