Manufacturer Part #
CY8C28645 Series 16 kB Flash 1 kB RAM 24 MHz 8-Bit PSoC®1 - QFN-48
|Standard Pkg:|| |
Product Variant Information section
260 per Tray
Subject: Qualification of HHGrace Fab3 as an Additional Wafer Fab Site for Select Industrial PSoC® 1 Products Change Type: Major Description of Change: Cypress announces the qualification of HHGrace Fab3 (1399 Zu Chong Zhi Road, Zhangjiang Hi-Tech Park, Shanghai, 201203, People's Republic of China) as an additional wafer fab site for select Industrial PSoC® 1 products. This qualification is part of the flexible manufacturing initiative which allows Cypress to meet its delivery commitments in dynamic and changing market conditions. Benefit of Change: Qualification of alternate manufacturing sites is part of the ongoing flexible manufacturing initiative announced by Cypress. The goal of the flexible manufacturing initiative is to provide the means for Cypress to continue to meet delivery commitments through dynamic, changing market conditions. Qualification Status: This wafer fab site has been qualified through a series of tests documented in the Qualification Test Plan QTP#164014. This qualification report can be found as an attachment to this PCN or by visiting www.cypress.com and typing the QTP number in the keyword search window. Approximate Implementation Date: Effective 90 days from the date of this notification or upon customer approval, whichever comes first, all shipments of Commercial, Industrial and Automotive non-PPAP part numbers in the attached file will be supplied from HHGrace Fab3 or other approved wafer fabrication sites. Anticipated Impact: Products fabricated at the new site are completely compatible with existing products from form, fit, functional, parametric and quality performance perspectives. Cypress also recommends that customers take this opportunity to review these changes against current application notes, system design considerations and customer environment conditions to assess impact (if any) to their application.
Addendum to PIN195102 - Manufacturing Label and Packing Configuration Standardization Description of Change: The purpose of this addendum is to correct the date from January 20, 2019 to January 20, 2020, in the "3rd paragraph in the 'Description of Change' section. This notification is to inform customers that Cypress will be standardizing its manufacturing labels and tray/tube packing configuration. It may be recalled that the Cypress entity consolidation (following the merger with Spansion Corp) was announced via Product Information Notification PIN174801 in November 2017. As the next phase of the entity consolidation process, Cypress will be adapting a new manufacturing label format for all products and revising shipping configurations for select product shipped in trays and tubes.
Addendum to PCN190302 (Future PCN 64206) - Qualification of G700LA Mold Compound, Pure Sn Leadfinish and CuPdAu Wire for Select QFN Packages Assembled at ASE-KH Description of Change: The purpose of this addendum is to update the affected parts list communicated in the initial PCN190302. Cypress announced the qualification of G700LA mold compound, Pure Sn leadfinish and CuPdAu wire for select QFN packages assembled at Advanced Semiconductor Engineering-Kaohsiung (ASE-KH, 26 Chin 3rd Rd., 811, Nantze Export Processing Zone Kaohsiung, Taiwan, R.O.C.).
Qualification of G700LA Mold Compound, Pure Sn Leadfinish and CuPdAu Wire for Select QFN Pb-Free Packages Assembled at ASE-KH Description of Change: Cypress announces the qualification of G700LA mold compound, Pure Sn leadfinish and CuPdAu wire for select QFN Pb-Free packages assembled at Advanced Semiconductor Engineering-Kaohsiung (ASE-KH, 26 Chin 3rd Rd., 811, Nantze Export Processing Zone Kaohsiung, Taiwan, R.O.C.). This mold compound is consistent with Cypress' drive to Green and Pb-free RoHS compliant packages. In addition, this Green and Pb-free G700LA mold compound is compatible with industry standard reflow temperatures for applicable package volume, thickness and lead finish. Also, the new leadfinish and new bond wire type is compatible with industry standards.
Description of Alert: PSoC� 1 and derivative devices began shipping in 2002, and over time they have been successfully used in a broad spectrum of applications. Unfortunately, it has recently been discovered that a skilled hacker with physical possession of a device and specific hardware and software tools can use the device in a manner not intended, and extract the data stored in Flash in circumvention of the ProtectBlock feature. Cypress is issuing this PIN to notify our customers about the recent event. PSoC� 1 and derivative devices offer external access and control of device resources through a debug/programming mode which uses the In-system Serial Programming Protocol (ISSP). If the designer chooses, it is possible to prevent external read and write access of Flash during this mode by using the ProtectBlock feature. However, the feature does not block access to SRAM memory. As a result, it is possible to circumvent the ProtectBlock feature by conducting system operations on Flash (such as CHECKSUM), capturing intermediate results in SRAM, and then indirectly reconstructing the Flash image.Note that putting the device into debug/programming mode requires presenting specific commands to the ISSP pins, clocking them in, and reading results. This typically can only be done with direct physical access to the ISSP pins and using specific external hardware and software tools. Affected PSoC� 1 and derivative device documentation will be updated to clarify the capability of ProtectBlock. Applications that do not use the ProtectBlock feature are not affected.
Planned Qualification of Spansion Manufacturing Sites for Cypress ProductsDescription of Change:In concert with the recently announced merger between Cypress Semiconductor Corporation (Cypress) and Spansion Inc. (Spansion), Cypress announces plans to qualify proprietary SONOS Technology products at Spansion Fab 25 / Test 25 in Austin, Texas and BGA/TSOP-packaged products at the Spansion assembly facility in Bangkok, Thailand. These qualifications and implementations are expected to occur throughout 2015 and 2016. Once complete, the qualifications will be announced through regular PCNs.This is an advance notification and no immediate action is needed. Refer to the attached Supplier documentation for the complete schedule of the activity, PCN issue dates and shipment start dates.
|Program Memory Type:||Flash|
|Flash Size (Bytes):||16kB|
|No of I/O Lines:||44|
|InterfaceType / Connectivity:||I2C/SPI/UART|
|Supply Voltage:||3V to 5.25V|
|Operating Temperature:||-40°C to +85°C|
|Mounting Method:||Surface Mount|
Features & Applications
260 per Tray