Manufacturer Part #
CY8C38 Series 8 kB RAM 64 kB Flash 62 I/O SMT 8-Bit Microcontroller - WLCSP-72
|Standard Pkg:|| |
Product Variant Information section
2000 per Reel
Description of Change: Deca Technologies (DT) which is a qualified assembly/finish/test subcontractor for Cypress, has changed their name to nepes hayyim Corporation Inc. This change will not interrupt production of customers products. nepes hayyim Corporation will continue to manufacture customers products using the current manufacturing process at the same location which is 100 East Main Avenue 4024 Bi�an City, Bi�an Laguna, Philippines. There has been no change in the range of products and services offer, and the name change will not impact on ongoing and future business.
Subject: Qualification of ASE Kaohsiung (ASE-KH) as an Additional Bumping and Finish Process Site for Select WLCSP Products Change Type: Major Description of Change: Cypress announces the qualification of Advanced Semiconductor Engineering Inc. (ASE-KH, No.47, Kaifa Road, N.E.P.Z. Kaohsiung City 811, Taiwan, R.O.C.) as an additional bumping and finish process site for select WLCSP products. ASE-KH is Cypress' existing manufacturing site for many other WLCSP products in high volume production mode. Benefit of Change: Qualification of alternate manufacturing sites is part of the ongoing flexible manufacturing initiative announced by Cypress. The goal of the flexible manufacturing initiative is to provide the means for Cypress to continue to meet delivery commitments through dynamic, changing market conditions. Approximate Implementation Date: Effective 90 days from the date of this notification or upon customer approval, whichever comes first, all shipments of Commercial, Industrial and Automotive non-PPAP part numbers in the attached file will be assembled at ASEKH or other approved assembly sites. Anticipated Impact: Products assembled at the new site are completely compatible with existing products from form, fit, functional, parametric and quality performance perspectives. Cypress also recommends that customers take this opportunity to review these changes against current application notes, system design considerations and customer environment conditions to assess impact (if any) to their application. .
Addendum to PIN195102 - Manufacturing Label and Packing Configuration Standardization Description of Change: The purpose of this addendum is to correct the date from January 20, 2019 to January 20, 2020, in the "3rd paragraph in the 'Description of Change' section. This notification is to inform customers that Cypress will be standardizing its manufacturing labels and tray/tube packing configuration. It may be recalled that the Cypress entity consolidation (following the merger with Spansion Corp) was announced via Product Information Notification PIN174801 in November 2017. As the next phase of the entity consolidation process, Cypress will be adapting a new manufacturing label format for all products and revising shipping configurations for select product shipped in trays and tubes.
|Program Memory Type:||Flash|
|Flash Size (Bytes):||64kB|
|No of I/O Lines:||62|
|Number Of Timers:||4|
|Supply Voltage:||1.71V to 5.5V|
|Operating Temperature:||-40°C to +85°C|
|Moisture Sensitivity Level:||1|
|Mounting Method:||Surface Mount|
2000 per Reel