Manufacturer Part #
INTEGRATED CIRCUIT- MM MCU
Subject: Minimum Order Quantity, Packing and Shipping Configuration Standardization for Non-Memory ProductsChange Type: Minor Description of Change: This notification is to inform customers that Cypress will be standardizing its Full Box Quantity to a sellable quantity in the market where it will be able to round the orders in increment of this full box quantity. It may be recalled that Cypress had implemented Manufacturing Label and Packing Configuration Standardization via Product Information Notification PIN195102 in December 2019. As part of the Cypress integration into Infineon Shipping Standard, Cypress will be adjusting Minimum Order Quantity (MOQ), Order Increment (OI) to align them with new Full Box Quantity for select parts shipped in trays and tubes. These changes will be implemented immediately at all Cypress in-house and qualified subcontractor locations. Please be advised that starting July 5, 2021, all new orders must follow these new Minimum Order Quantity (MOQ)/Order Increment (OI) and Cypress will start shipping orders in new full box quantity configuration. The existing orders can remain in old MOQ/OI through end of December 2021, or change orders requiring additional lines/quantities, whichever occurs first. The transition period where customers should expect to receive either current or new shipping configurations is expected to end in December 2021. Starting January 2022, all orders must conform with the new MOQ and any existing orders not yet in new MOQ must be changed by December 15, 2021. Benefit of Change: The change is part of Cypress' continuous improvement initiative, intended to provide Cypress the means to packaging flexibility and process standardization to match industry standards and reliably meet customer delivery requirements Approximate Implementation Date: This change will be implemented on July 05, 2021. Anticipated Impact: Cypress, an Infineon Technologies Company also recommends that customers take this opportunity to review these changes against current order profile since the change will align to Infineon shipping standard as we will move our Finished Goods inventory to Infineon's Distribution Centers in Singapore and Shanghai respectively. Customers should also update their MRP or order entry systems to reflect these changes.
Description of Change: Cypress announces the qualification of Amkor Technology Japan Usuki (ATJ, 1913-2, Takegashita, Fukura, Usuki-shi,Oita 875-0053, Japan) as a new Die Processing Service (DPS) site for select MCU Products. The current products are processed at Amkor Technology Japan Kitsuki (ATJ, 2820-2, Minami-Kitsuki, Kitsuki-shi, Oita 873-0002, Japan). The change corresponds to Category (DPS Usuki) in APCN194303. Amkor Technology Japan Usuki is certified by international quality standards, ISO 9001 and IATF16949. Amkor
Description of Change: J-Devices Corporation (JD), which is a qualified assembly/finish/test subcontractor for Cypress, is changing their name to Amkor Technology Japan, Inc. (ATJ, New Stage Yokohama Bldg. 17F, 1-1-32 Shinurashima-cho, Kanagawa-ku, Yokohama, Kanagawa 221-0031 Japan). Amkor Technology Japan took 100% ownership of J-Devices last January 2016, and this official name change furthers alignment with Amkor company brand and is intended to provide customer with full benefits of a longer, global company. There has been no change in the range of products and services offer, and the name change will not impact on ongoing and future business.