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Manufacturer Part #
PIC12F1822T-E/SN
PIC12F Series 3.5 kB Flash 128 B SRAM SMT 8-Bit Microcontroller - SOIC-8
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| Mfr. Name: | Microchip | ||||||||||
| Standard Pkg: | Product Variant Information section Available PackagingPackage Qty:3300 per Reel Package Style:SOIC-8 Mounting Method:Surface Mount | ||||||||||
| Date Code: | |||||||||||
Product Specification
Shipping Information:
ECCN:
PCN Information:
Microchip has released a new Product Documents for the PIC12(L)F1822/PIC16(L)F1823 8/14-Pin Flash MCUs w/ XLP Technology of devices.Notification Status: Final Description of Change: 1) Updated Table 33-2Impacts to Data Sheet: NoneReason for Change: To Improve ProductivityChange Implementation Status: CompleteDate Document Changes Effective: 1 July 2020 NOTE: Please be advised that this is a change to the document only the product has not been changed.
Product Category:8-bit MicrocontrollersPCN Type:Document ChangeNotification Subject:Data Sheet - PIC12(L)F1822/PIC16(L)F1823 8/14-Pin Flash MCUs w/ XLP TechnologyNotification Text:SYST-30KVGN402Microchip has released a new Product Documents for the PIC12(L)F1822/PIC16(L)F1823 8/14-Pin Flash MCUs w/ XLP Technology ofdevices. If you are using one of these devices please read the document located at PIC12(L)F1822/PIC16(L)F1823 8/14-Pin FlashMCUs w/ XLP Technology.Notification Status: FinalDescription of Change:1) Updated Table 33-2Impacts to Data Sheet: None Reason for Change: To Improve ProductivityChange Implementation Status: CompleteDate Document Changes Effective: 1 July 2020NOTE: Please be advised that this is a change to the document only the product has not been changed.Markings to Distinguish Revised from Unrevised Devices: N/A
Description of Change:Qualification of palladium coated copper with gold flash (CuPdAu) bond wire in selected products available in 8L and 14L SOIC package at MTAI assembly site.Pre Change: Using Palladium coated copper wire (PdCu) bond wirePost Change: Using palladium coated copper with gold flash (CuPdAu) bond wireReason for Change:To improve productivity by qualifying palladium coated copper with gold flash (CuPdAu) bond wire.Estimated First Ship Date: February 22, 2018 (date code: 1808)
PCN Status: Final notificationDescription of Change:Qualification of palladium coated copper with gold flash (CuPdAu) bond wire in selected products of the 40K, 42K, 77K, 120K, 150K, 160K and 200K wafer technologies available in 8L SOIC package at MMT assembly site.Pre Change: Gold (Au) or Palladium coated copper wire (PdCu) bond wirePost Change:Palladium coated copper with gold flash (CuPdAu) bond wire
Final Notice: Qualification of CuPdAu bond wire in selected products of the 40K, 42K, 77K, 120K, 150K, 160K and 200K wafer technologies available in 8L SOIC package at MMT assembly site. Description of Change: Qualification of palladium coated copper with gold flash (CuPdAu) bond wire in selected products of the 40K, 42K, 77K, 120K, 150K, 160K and 200K wafer technologies available in 8L SOIC package at MMT assembly site.Pre Change: Gold (Au) or Palladium coated copper wire (PdCu) bond wirePost Change: Palladium coated copper with gold flash (CuPdAu) bond wireNOTE: Please be advised that after the estimated first ship date customers may receive pre and post change parts.
Final Notice: Qualification of CuPdAu bond wire in selected products of the 40K, 42K, 77K, 120K, 150K, 160K and 200K wafer technologies available in 8L SOIC package at MMTPre Change: Gold (Au) or Palladium coated copper wire (PdCu) bond wirePost Change:Palladium coated copper with gold flash (CuPdAu) bond wire
Product Lifecycle:
Technical Attributes
| Family Name: | PIC12F |
| Core Processor: | PIC |
| Program Memory Type: | Flash |
| Flash Size (Bytes): | 3.5kB |
| RAM Size: | 128B |
| Speed: | 32MHz |
| No of I/O Lines: | 6 |
| InterfaceType / Connectivity: | I2C/LIN/SPI/UART |
| Peripherals: | POR/PWM/Watchdog |
| Number Of Timers: | 2 |
| Supply Voltage: | 1.8V to 5.5V |
| Operating Temperature: | -40°C to +125°C |
| On-Chip ADC: | 4-chx10-bit |
| Watchdog Timers: | 1 |
| Package Style: | SOIC-8 |
| Mounting Method: | Surface Mount |
Available Packaging
Package Qty:
3300 per Reel
Package Style:
SOIC-8
Mounting Method:
Surface Mount
