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Manufacturer Part #
PIC16C55AT-04/SO
8-bit Microcontrollers - MCU .75KB 24 RAM 20 I/O 4MHz SOIC-28
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| Mfr. Name: | Microchip | ||||||||||
| Standard Pkg: | Product Variant Information section Available PackagingPackage Qty:1600 per Reel | ||||||||||
| Date Code: | |||||||||||
Product Specification
Shipping Information:
ECCN:
PCN Information:
Notification subject: CCB 3217 and CCB 3217.001 Final Notice: Qualification of palladium coated copper with gold flash (CuPdAu) bond wire in selected products available in 18L and 28L SOIC package at MTAI assembly sitePCN Status:Final notificationPCN Type: Manufacturing ChangeDescription of Change: Qualification of palladium coated copper with gold flash (CuPdAu) bond wire in selected products available in 18L and 28L SOIC package at MTAI assembly sitePre Change: Using palladium coated copper wire (PdCu) bond wirePost Change: Using palladium coated copper with gold flash (CuPdAu) bond wireImpacts to Data Sheet: NoneChange Impact: NoneReason for Change: To improve productivity by qualifying palladium coated copper with gold flash (CuPdAu) bond wireChange Implementation Status: In ProgressEstimated First Ship Date: September 16, 2018 (date code: 1838)NOTE: Please be advised that after the estimated first ship date customers may receive pre and post change parts.Method to Identify Change: Traceability codeRevision History: March 08, 2018: Issued initial notification.August 16, 2018: Issued final notification. Attached the Qualification Report. Revised the affected parts list. Provided estimated first ship date on September 16, 2018. The change described in this PCN does not alter Microchip's
Part Status:
Available Packaging
Package Qty:
1600 per Reel
