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Manufacturer Part #
PIC18LF26K22-I/SO
PIC18 Series 64 kB Flash 3.8 kB RAM SMT 8-Bit Microcontroller - SSOP-28
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| Mfr. Name: | Microchip | ||||||||||
| Standard Pkg: | Product Variant Information section Available PackagingPackage Qty:27 per Tube Package Style:SOIC-28 Mounting Method:Surface Mount | ||||||||||
| Date Code: | 2032 | ||||||||||
Product Specification
Shipping Information:
ECCN:
PCN Information:
Notification subject: CCB 3217 and CCB 3217.001 Final Notice: Qualification of palladium coated copper with gold flash (CuPdAu) bond wire in selected products available in 18L and 28L SOIC package at MTAI assembly sitePCN Status:Final notificationPCN Type: Manufacturing ChangeDescription of Change: Qualification of palladium coated copper with gold flash (CuPdAu) bond wire in selected products available in 18L and 28L SOIC package at MTAI assembly sitePre Change: Using palladium coated copper wire (PdCu) bond wirePost Change: Using palladium coated copper with gold flash (CuPdAu) bond wireImpacts to Data Sheet: NoneChange Impact: NoneReason for Change: To improve productivity by qualifying palladium coated copper with gold flash (CuPdAu) bond wireChange Implementation Status: In ProgressEstimated First Ship Date: September 16, 2018 (date code: 1838)NOTE: Please be advised that after the estimated first ship date customers may receive pre and post change parts.Method to Identify Change: Traceability codeRevision History: March 08, 2018: Issued initial notification.August 16, 2018: Issued final notification. Attached the Qualification Report. Revised the affected parts list. Provided estimated first ship date on September 16, 2018. The change described in this PCN does not alter Microchip's
Microchip has released a new DeviceDoc for the PIC18(L)F26/45/46K40 28/40/44-Pin, Low-Power High-Performance MCU with XLP of devices. PIC18(L)F26/45/46K40 28/40/44-Pin, Low-Power High-Performance MCU with XLP Notification Status: FinalDescription of Change: 1) Fixed errors in the 44-pin TQFP and QFN pin diagrams. 2) Split TMR0 register (18.6.3) into separate 8-bit registers called TMR0H (18.6.3) and TMR0L (18.6.4). 3) Updated Equation 31-1. 4) Correct typosImpacts to Data Sheet: NoneReason for Change: To Improve ManufacturabilityChange Implementation Status: CompleteDate Document Changes Effective: 19 April 2018NOTE: Please be advised that this is a change to the document only the product has not been changed.Markings to Distinguish Revised from Unrevised Devices: N/A.
Description of Change:Qualification of palladium coated copper with gold flash (CuPdAu) bond wire in selected products available in 18L and 28L SOIC package at MTAI assembly site.Pre Change: Using palladium coated copper wire (PdCu) bond wire.Post Change:Using palladium coated copper with gold flash (CuPdAu) bond wireReason for Change:To improve productivity by qualifying palladium coated copper with gold flash (CuPdAu) bond wire Estimated Qualification Completion Date:April 2018
Product Lifecycle:
Technical Attributes
| Family Name: | PIC18 |
| Core Processor: | PIC |
| Program Memory Type: | Flash |
| Flash Size (Bytes): | 64kB |
| RAM Size: | 3.8kB |
| Speed: | 64MHz |
| No of I/O Lines: | 24 |
| InterfaceType / Connectivity: | I2C/SPI/UART/USART |
| Peripherals: | Brown-out Detect/HLVD/POR/PWM/Reset/Watchdog |
| Number Of Timers: | 7 |
| Supply Voltage: | 1.8V to 3.6V |
| Operating Temperature: | -40°C to +85°C |
| On-Chip ADC: | 19-chx10-bit |
| Watchdog Timers: | 1 |
| Package Style: | SOIC-28 |
| Mounting Method: | Surface Mount |
Available Packaging
Package Qty:
27 per Tube
Package Style:
SOIC-28
Mounting Method:
Surface Mount
