Manufacturer Part #
IC FPGA 418 I/O 676FBGA
Addendum A: Additional affected devices listed at end of Appendix A. BGA Devices with Halogenated Substrates Will Change to Halide-free Substrate Material (Addendum A) Description of Change: Devices in BGA packages that use halogenated substrates will use halide-free (green) substrates. Solder masks will also change.
Transfer of Logistics Processes from Avnet Logistics to JSI Logistics. Description of Change: Addition of JSI Logistics (Hong Kong) to Microsemi SoC Corporate suppliers list. Addendum A: Revised effective date to November 1, 2016 and added impacted parts list. Reason for Change: Supplier consolidation to streamline the supply chain. There is no anticipated impact in form, fit, function, quality, and reliability to Microsemi SoC