
Manufacturer Part #
LAXP2-17E-5FTN256E
LA-XP2 Series 17000 Cell 201 I/O 1.26V Field Programmable Gate Array - FTBGA-256
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Mfr. Name: | Lattice Semiconductor | ||||||||||
Standard Pkg: | Product Variant Information section Available PackagingPackage Qty:90 per Tray Package Style:FTBGA-256 Mounting Method:Surface Mount | ||||||||||
Date Code: | 1843 |
Product Specification
Shipping Information:
ECCN:
PCN Information:
Change Description: In response to consumer demand for non-Halogenated IC's, substrate supplier Mitsubishi Gas Chemical (MGC) has announced the discontinuance of Halogenated materials by the end of 2017. Lattice's assembly/test supplier, ASEM, uses MGC products in select BGA substrates and will also be converting to the new non-Halogenated materials. The substrate core and prepreg dielectric material will change from CCL-HL832/GHPL-830 to CCL-HL832NX/GHPL-830NX. All compounds are manufactured by MGC. This change will not impact the device form, fit or function. Note that the new material set combination is already in-use on other Lattice products at ASEM and at other Lattice suppliers. No electrical performance difference has been measured or is expected. This PCN also affects any custom devices (i.e. factory programmed, special test, tape and reel, non-standard speed grade and package, etc.), which are derived from any of the devices listed.Device Identification This PCN only pertains to devices that are packaged at ASEM. Those devices are identified by an "R" or "1" in the 5th character in the Inspection Lot number on the topside of the package
Product Lifecycle:
Technical Attributes
Programmable Type: | SRAM |
No of I/O Lines: | 201 |
No of Logic Elements: | 17000 |
Memory Density: | 276kb |
Supply Voltage: | 1.14V to 1.26V |
Package Style: | FTBGA-256 |
Mounting Method: | Surface Mount |
Available Packaging
Package Qty:
90 per Tray
Package Style:
FTBGA-256
Mounting Method:
Surface Mount