Manufacturer Part #
LIF-MID6000 Series 184320 Bit RAM 37 I/O 1.26 V CrossLink FPGA - CSFBGA-81
|Mfr. Name:||Lattice Semiconductor|
|Standard Pkg:|| |
Product Variant Information section
490 per Tray
Notification of Intent to Utilize an Alternate Qualified Foundry and Alternate Qualified Mask Sets for the select ECP5U and CrossLink Products Change Description In an effort to expand ECP5U and CrossLink manufacturing capacity we are adding the United Semiconductor Japan Company Ltd. (USJC), formerly Fujitsu Semiconductor, fab in Mie, Japan. There have been no changes made to the device's form, fit or function.
Notification of Changes to CrossLink - Data Sheet and CrossLink- Automotive Data Sheet Change Description:The new CrossLink Family Data Sheet (FPGA-DS-02007 version 1.6 dated September 2019) includes updates to parameters.See the data sheet revision history for other clarifications and changes. There will be no changes to Diamond® 3.11 Software relating to this data sheet change.
Notification of Changes to CrossLink™ Data Sheets Change Description The new CrossLink Family Data Sheet (FPGA-DS-02007 Version 1.5 dated July 2018) and CrossLink Automotive Family Data Sheet (FPGA-DS-02013 Version 1.4 dated July 2018) added a new note #4 to Table 4.1 and a new note #3 to Table 4.2 of both Data Sheets.
Notification of Changes to the CrossLink™ Data Sheet Change Description The new CrossLink Family Data Sheet (FPGA-DS-02007 Version 1.4 dated February 2018) includes adjustments to two parameters.There is no change to any device bitstream design. There will be a change to the DiamondTM 3.10SP2 software which is scheduled to be released on March 29, 2018.
|No of I/O Lines:||37|
|No of Logic Elements:||5936|
|Supply Voltage:||1.14V to 1.26V|
|Operating Temp Range:||-40°C to +100°C|
|Storage Temperature Range:||-65°C to +150°C|
|No of Terminals:||81|
|Mounting Method:||Surface Mount|
490 per Tray