Manufacturer Part #
A2F200 Series 200000 System Gate 117 I/O 1.57 V Surface Mount FPGA - FPBGA-256
PCN Status:Initial notification.PCN Type: Manufacturing ChangeDescription of Change:Qualification of ASEM as a new assembly site for selected Microsemi products available in 144L, 256L, and 324L LFBGA, 281L and 288L TFBGA packages.Impacts to Data Sheet:None.Change Impact:NoneReason for Change:To improve productivity by qualifying ASEM as a new assembly site.Note: Because of capacity constraints that have been observed throughout the industry there may be limited or no inventory available as identified in the pre-change.Change Implementation Status:In ProgressEstimated Qualification Completion Date:December 15, 2021
Description of Change:Implement Microchip Part Aging Policy, Recertification and Combination rules, Labels and Packing Changes for selected Microsemi Field Programmable Gate Array (FPGA) and Mixed Signal and ASIC(MSA) products.Pre Change: Using Microsemi�s packing processPost Change:Using Microchip�s packing processPre and Post Change Summary:NOTE: See attached Packing Pre and Post Changes for the changes Impacts to Data Sheet:NoneChange Impact:NoneReason for Change:To improve productivity by standardizing the packing method as part of the integration of Microsemi and Microchip.Change Implementation Status:In ProgressEstimated Implementation Date: February 15, 2021 (date code: 2108)Note: The earliest implementation date is the earliest date that we may implement any combination of the changes listed in this PCN as we will not implement any of the proposed changes prior to this date. After the earliest implementation date these changes may occur to any product over the course of many months depending on inventory levels and business conditions.Time Table Summary: see attachedRevision History:January 18, 2021: Issued final notification. Provided estimated first ship date to be on February 15, 2021.The change described in this PCN does not alter Microchip�s current regulatory compliance regarding the material content of the applicable products.
Description of Change: Implement Microchip Top marking changes for selected Microsemi Field-Programmable Gate Arrays (FPGAs) products available in various packages.Pre Change: Microsemi top marking format and traceability codePost Change: Microchip top marking format and traceability codePre and Post Change Summary: see attachedImpacts to Data Sheet: Where applicableChange Impact: NoneReason for Change:To improve manufacturability and traceability by standardizing marking format for selected Microsemi products as part of the integration of Microchip and Microsemi.Change Implementation Status: In ProgressEarliest Implementation Date: March 1, 2021 (Date code: 2110)Note: The earliest implementation date is the earliest date that we may implement any combination of the changes listed in this PCN as we will not implement any of the proposed changes prior to this date. After the earliest implementation date these changes may occur to any product over the course of many months depending on inventory levels and businessconditions.Time Table Summary:
Conversion to Cu Wire for SmartFusion, IGLOO2, and SmartFusion2 (Addendum)Microsemi SoC successfully completed the qualification run to convert IGLOO2/SmartFusion2 devices in TQG144 from Au wire to Gold Coated Palladium Copper wire (AuPdCu, also known as AuPCC).The qualification run for SmartFusion in FG/FGG256 has been postponed and new expected qualification completion is by March 15, 2021.There is no change in assembly site location. SmartFusion devices in FG/FGG256 will remain at UTAC in Dongguan China. IGLOO2/SmartFusion2 devices in TQG144 assembly support will remain at Amkor Philippines.
Conversion to Cu Wire for SmartFusion, IGLOO2, and SmartFusion2DescriptionMicrosemi SoC group is currently performing qualification runs to convert SmartFusion in FG/FGG256 and IGLOO2/SmartFusion2 devices in TQ/TQG144 from Au wire to Gold Coated Palladium Copper wire (AuPdCu, also known as AuPCC). Qualification run is in-process. Expected completion is on or before June 15, 2020.There is no change in assembly site location. SmartFusion devices in FG/FGG256 will remain at UTAC in Dongguan China. IGLOO2/SmartFusion2 devices in TQ/TQG144 assembly support will remain at Amkor Philippines.Reason for ChangeConversion to AuPdCu (AuPCC) wire is aligned with the current industry trend. Our assembly vendors have extensive experience in copper bond wire assembly. There is no expected impact in product moisture sensitivity level (MSL), product functionality, performance, quality, or reliability. Products assembled with copper wire only use halogen-free materials.Production Shipment ScheduleMicrosemi may begin shipping parts by June 30, 2020.Microsemi reserves the right to continue the shipment of devices with Au wire following the change of implementation date.Customers may receive a mix of pre-conversion products with Au wire and products with AuPdCu (AuPCC) wire interchangeably, following the change of implementation date. Customers may receive a mix of pre-conversion products with Au wire and products with AuPdCu (AuPCC) wire interchangeably, following the change of implementation date.Application ImpactThere is no change in form, fit, function, quality, or reliability of the devices.
ProASIC3, IGLOO, Fusion, SmartFusion, ProASIC Plus, MX, and AX Family Devices - Change of Mold Compound and Die-Attach EpoxyDescription of ChangeDevices listed in the attached supplier PCN will change their mold compound and die-attach epoxy materials. There is no change to the device form, fit, or function.
Subject: Addition of Microchip-Thailand as a New Test Location for Microsemi FPGA Business Unit Products Group (Addendum)Description of Change: This notice is to inform you that Microchip Thailand has been added for product test and shipping processes for various products in all applicable product offerings. (See Appendix A for the list of affected part numbers.) The following are the various processes that can be performed at the additional location:a.) Electrical test (final test, QA electrical, and temperature testing)b.) Programmingc.) End of Line activities (EOL) such as baking, dry packing, coplanarity, pack/seal, and demark/add a markd.) Shipping and inventory managementReason for Change: The purpose of this PCN is to streamline manufacturing operations using Microchip's internal facilities.Application Impact: There is no change to form, fit, function, quality, or reliability of the product shipped from the new location.Products Affected by Change: See Appendix A for the complete list of devices.Product Shipment Schedule: Products from the new location are planned to ship no sooner than April 2019, unless the customer can provide a waiver for products to be shipped before April 2019. Post April 2019, customers may see shipments from all approved locations.Qualification Data: Documented information pertaining to this change is available upon request by CYQ2 2019.Samples Availability: Please contact your local Microsemi/Microchip representative to place sample orders as required.
Addition of Microchip-Thailand (MTAI) as a New Test Location for Microsemi FPGA Business Unit Products GroupDescription of ChangeThis notice is to inform you that MTAI has been added as a test location for various products in both the RoHS-compliant and the standard package offerings. Following are the various processes that can be performed at this location:a.) Electrical test (Final test, QA Electrical, Temperature testing)b.) Programmingc.) End of Line activities (EOL) i.e. banking, dry packing, coplanarity, pack/seal, denmark/add a markd.) Shipping and Inventory Managment
Description:This change notification affects all Commercial/Industrial Temperature grade SmartFusion devices. Minor updates to the SmartFusion datasheet have occurred.Description of Change:SPI timing characteristics for Setup/Hold (sp6/sp7/sp8/sp9) on Table 2-100 SPI Characteristics will be updated.Reason for change: The existing table, as follows, specifies values at 1 PCLK. The revised table, as shown previously, specifies absolute timing in nanoseconds, which is more accurate.
Addendum to PCN1309 and PCN1309A - Synopsys Synplify Pro Software Bug Regarding Safe State Machine RecoveryDescriptionMicrosemi and Synopsys have recently become aware of a scenario that can result in a state machine design not being implemented with logic circuits which force the state machine into a reset state if an illegal state is detected.Description of the ProblemWhen a design is synthesized with the one-hot state machine encoding style and includes state machines with only two states, Synplify Pro may not recognize them as state machines. If the state machine is marked for "safe" implementation, and this bug affects the design, then the inferred extra logic that forces a reset during an illegal state condition will not be added. This problem can occur only when all of the following conditions are true.The design is synthesized with the "safe" encoding style for the state machine (the user has specified syn_encoding=�safe�).The state machine is instructed to use "onehot" encoding through the Implementation Options > VHDL setting.The state machine has only two states.The state machine does not have a syn_state_machine="true" attribute.