Manufacturer Part #
|Mfr. Name:||Maxim Integrated|
CHANGE FROM: - For automotive products in TQFN/TDFN packages, body size 2x2mm to 7x7mm, Au wire size 0.8/1.0/1.3/2.0 mil Current mold compound Sumitomo G770HJ used at Assembler Vendor ASECL (ASE/CHUNG-LI/Taiwan).CHANGE TO: -The replacement mold compound Sumitomo G700LA will be used for these devices at the same Assembly Vendor ASECL. This mold compound is an existing standard encapsulant for many other Maxim devices at this site.JUSTIFICATION: Industry shortage of Sumitomo G770HJ requires that Maxim convert these devices to Sumitomo G700LA mold compound to ensure continuity of supply.Maxim uses G700LA mold compound for many other automotive devices that are shipping in high volume since 2017.- The AECQ-100 Qualification report is attached.- Technical specification sheet G770HJ vs. G700LA is attached.- Samples will be built upon request.- There are no regulatory compliance changes to the material content of the devices.- There are no changes to the form/fit/function of these devices using the new mold compound.