Manufacturer Part #
CY7C63823 Series SPI/GPIO/USB 5.5 V Surface Mount USB - SOIC-24
|Standard Pkg:|| |
Product Variant Information section
1000 per Reel
Subject: USB Products Failure Analysis Policy Change Description of Change: Cypress is changing its policy for failure analysis of USB products to only accept units for failure analysis if the customer has successfully completed an ABA swap test1 for non-WLCSP/BGA packages or chip isolation test for WLCSP/BGA packages to confirm the failure was caused by the Cypress device. Additional information to replicate and solve the customer issue in a timely manner will be required. Benefit of Change: By implementing this policy change, Cypress will better be able to respond to the confirmed issues customers are observing. This policy change is required due to the large percentage of NTF (No Trouble Found) results on USB failure analysis cases. Approximate Implementation Date: This change will be implemented effective with the date of this notification.
Addendum to PIN195102 - Manufacturing Label and Packing Configuration Standardization Description of Change: The purpose of this addendum is to correct the date from January 20, 2019 to January 20, 2020, in the "3rd paragraph in the 'Description of Change' section. This notification is to inform customers that Cypress will be standardizing its manufacturing labels and tray/tube packing configuration. It may be recalled that the Cypress entity consolidation (following the merger with Spansion Corp) was announced via Product Information Notification PIN174801 in November 2017. As the next phase of the entity consolidation process, Cypress will be adapting a new manufacturing label format for all products and revising shipping configurations for select product shipped in trays and tubes.
Planned Qualification of Spansion Manufacturing Sites for Cypress ProductsDescription of Change:In concert with the recently announced merger between Cypress Semiconductor Corporation (Cypress) and Spansion Inc. (Spansion), Cypress announces plans to qualify proprietary SONOS Technology products at Spansion Fab 25 / Test 25 in Austin, Texas and BGA/TSOP-packaged products at the Spansion assembly facility in Bangkok, Thailand. These qualifications and implementations are expected to occur throughout 2015 and 2016. Once complete, the qualifications will be announced through regular PCNs.This is an advance notification and no immediate action is needed. Refer to the attached Supplier documentation for the complete schedule of the activity, PCN issue dates and shipment start dates.
|No of Channels:||1|
|Supply Voltage:||4V to 5.5V|
|Operating Temp Range:||0°C to 70°C|
|Storage Temperature Range:||-40°C to +90°C|
|No of Pins:||24|
|Protocols Supported:||USB 2.0|
|Moisture Sensitivity Level:||3|
|Mounting Method:||Surface Mount|
1000 per Reel