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Manufacturer Part #
CY7C64713-56PVXC
CY7C64 Series 16 kb RAM EZ-USB FX1™ Full-Speed Peripheral Controller - SSOP-56
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| Mfr. Name: | Cypress | ||||||||||
| Standard Pkg: | Product Variant Information section Available PackagingPackage Qty:26 per Tube Package Style:SSOP-56 Mounting Method:Surface Mount | ||||||||||
| Date Code: | |||||||||||
Product Specification
Shipping Information:
ECCN:
PCN Information:
Subject: Minimum Order Quantity, Packing and Shipping Configuration Standardization for Non-Memory ProductsChange Type: Minor Description of Change: This notification is to inform customers that Cypress will be standardizing its Full Box Quantity to a sellable quantity in the market where it will be able to round the orders in increment of this full box quantity. It may be recalled that Cypress had implemented Manufacturing Label and Packing Configuration Standardization via Product Information Notification PIN195102 in December 2019. As part of the Cypress integration into Infineon Shipping Standard, Cypress will be adjusting Minimum Order Quantity (MOQ), Order Increment (OI) to align them with new Full Box Quantity for select parts shipped in trays and tubes. These changes will be implemented immediately at all Cypress in-house and qualified subcontractor locations. Please be advised that starting July 5, 2021, all new orders must follow these new Minimum Order Quantity (MOQ)/Order Increment (OI) and Cypress will start shipping orders in new full box quantity configuration. The existing orders can remain in old MOQ/OI through end of December 2021, or change orders requiring additional lines/quantities, whichever occurs first. The transition period where customers should expect to receive either current or new shipping configurations is expected to end in December 2021. Starting January 2022, all orders must conform with the new MOQ and any existing orders not yet in new MOQ must be changed by December 15, 2021. Benefit of Change: The change is part of Cypress' continuous improvement initiative, intended to provide Cypress the means to packaging flexibility and process standardization to match industry standards and reliably meet customer delivery requirements Approximate Implementation Date: This change will be implemented on July 05, 2021. Anticipated Impact: Cypress, an Infineon Technologies Company also recommends that customers take this opportunity to review these changes against current order profile since the change will align to Infineon shipping standard as we will move our Finished Goods inventory to Infineon's Distribution Centers in Singapore and Shanghai respectively. Customers should also update their MRP or order entry systems to reflect these changes.
Addendum to PCN 203103 - Transfer of Assembly Operations to Greatek Electronics Inc. for Select SOIC, SSOP and SOJ Packages Description of Change: The purpose of this addendum is to update JCET's BOM information as listed in BOM table below. There is no change to Greatek BOM and affected parts list. Cypress announced the qualification of Greatek Electronics Inc., Taiwan located at No. 136, Gong-Yi Rd., Zhunan Township, Miaoli County 350, Taiwan, as an alternate assembly site for select Memory and USB products offered in 32-Lead SOIC (450mil), 56-Lead SSOP (300mil) and 44-Lead SOJ (400mil), 36-Lead SOJ (400mil), 32-Lead SOJ (400mil), 32-Lead SOJ (300mil), 28-Lead SOJ (300mil) packages. These products are currently processed at Jiangsu Changjiang Electronics Technology Co., Ltd (JCET), Cypress' subcontractor in China. The transfer of assembly operations to Greatek is motivated by JCET's phasing out (i.e., End-Of-Life) of SOIC, SSOP and SOJ manufacturing operations, as previously announced in advance PCN (APCN 201001 and APCN 201002). Benefit of Change: Qualification of alternative manufacturing sites provides the means for Cypress to ensure business continuity on the stated products, and thereby meet long-term market demand and delivery commitments to customers after the phase out of operations at JCET.
Subject: USB Products Failure Analysis Policy Change Description of Change: Cypress is changing its policy for failure analysis of USB products to only accept units for failure analysis if the customer has successfully completed an ABA swap test1 for non-WLCSP/BGA packages or chip isolation test for WLCSP/BGA packages to confirm the failure was caused by the Cypress device. Additional information to replicate and solve the customer issue in a timely manner will be required. Benefit of Change: By implementing this policy change, Cypress will better be able to respond to the confirmed issues customers are observing. This policy change is required due to the large percentage of NTF (No Trouble Found) results on USB failure analysis cases. Approximate Implementation Date: This change will be implemented effective with the date of this notification.
Transfer of Assembly Operations to Greatek Electronics Inc. for Select SOIC, SSOP and SOJ Packages Description of Change: Cypress announces the qualification of Greatek Electronics Inc., Taiwan located at No. 136, Gong-Yi Rd., Zhunan Township, Miaoli County 350, Taiwan, as an alternate assembly site for select Memory and USB products offered in 32-Lead SOIC (450mil), 56-Lead SSOP (300mil) and 44-Lead SOJ (400mil), 36-Lead SOJ (400mil), 32-Lead SOJ (400mil), 32-Lead SOJ (300mil), 28-Lead SOJ (300mil) packages. These products are currently processed at Jiangsu Changjiang Electronics Technology Co., Ltd (JCET), Cypress' subcontractor in China. The transfer of assembly operations to Greatek is motivated by JCET's phasing out (i.e., End-Of-Life) of SOIC, SSOP and SOJ manufacturing operations, as previously announced in advance PCN (APCN 201001 and APCN 201002). Given the imminent phase out of operations at JCET, and the dynamically changing market conditions, Cypress is pleased to offer supply of changed material (i.e., Greatek assembled product) ahead of the implementation date. Customers are strongly encouraged to avail of this option, where production volumes of Greatek assembled product can be secured and shipped against current orders. Please contact your Cypress Sales Representative for more information on availing this option.
Addendum to PIN195102 - Manufacturing Label and Packing Configuration Standardization Description of Change: The purpose of this addendum is to correct the date from January 20, 2019 to January 20, 2020, in the "3rd paragraph in the 'Description of Change' section. This notification is to inform customers that Cypress will be standardizing its manufacturing labels and tray/tube packing configuration. It may be recalled that the Cypress entity consolidation (following the merger with Spansion Corp) was announced via Product Information Notification PIN174801 in November 2017. As the next phase of the entity consolidation process, Cypress will be adapting a new manufacturing label format for all products and revising shipping configurations for select product shipped in trays and tubes.
Part Status:
Technical Attributes
| Data Rate: | 12Mbps |
| No of Channels: | 1 |
| Supply Voltage: | 3.15V to 3.45V |
| Operating Temp Range: | 0°C to 70°C |
| Package Style: | SSOP-56 |
| Mounting Method: | Surface Mount |
Features & Applications
The EZ-USB FX1 is more economical, because it incorporates the USB transceiver and provides a smaller footprint solution than the USB SIE or external transceiver implementations. With EZ-USB FX1, the Cypress Smart SIE handles most of the USB protocol in hardware, freeing the embedded microcontroller for application specific functions and decreasing the development time to ensure USB compatibility. The General Programmable Interface (GPIF) and Master/Slave Endpoint FIFO (8 or 16-bit data bus) provide an easy and glueless interface to popular interfaces such as ATA, UTOPIA, EPP, PCMCIA, and most DSP/processors. Four Pb-free packages are defined for the family: 56-pin SSOP, 56-pin QFN, 100-pin TQFP, and 128-pin TQFP.
Features:
- Single chip integrated USB transceiver, SIE, and enhanced 8051 microprocessor
- Fit, form, and function upgradable to the FX2LP (CY7C68013A)
- Pin compatible
- Object code compatible
- Functionally compatible (FX1 functionality is a subset of the FX2LP)
- Draws no more than 65 mA in any mode, making the FX1 suitable for bus powered applications
- Software: 8051 runs from internal RAM, which is:
- Downloaded using USB
- Loaded from EEPROM
- External memory device (128 pin configuration only)
- 16 KB of on-chip code/data RAM
- Additional programmable (BULK/INTERRUPT) 64-byte endpoint
- 8- or 16-bit external data interface
- Smart media standard ECC generation Integrated, industry standard 8051 with enhanced features:
- Up to 48 MHz clock rate
- Four clocks for each instruction cycle
- Two USARTS
- Three counters or timers
- Expanded interrupt system
- Two data pointers
- 3.3 V operation with 5 V tolerant inputs
- Smart SIE
- Vectored USB interrupts
- Separate data buffers for the setup and DATA portions of a CONTROL transfer
- Integrated I2C controller, running at 100 or 400 KHz
- 48 MHz, 24 MHz, or 12 MHz 8051 operation
- Four integrated FIFOs
- Vectored for FIFO and GPIF Interrupts
- Up to 40 general purpose IOs (GPIO)
Applications:
- DSL modems
- ATA interface
- Memory card readers
- Legacy conversion devices
- Home PNA
- Wireless LAN
- MP3 players
- Networking
Available Packaging
Package Qty:
26 per Tube
Package Style:
SSOP-56
Mounting Method:
Surface Mount