Manufacturer Part #
CY7C65215 Series 12 Mbps USB-Serial Dual-Channel Bridge - QFN-32EP
|Standard Pkg:|| |
Product Variant Information section
2500 per Tray
Subject: USB Products Failure Analysis Policy Change Description of Change: Cypress is changing its policy for failure analysis of USB products to only accept units for failure analysis if the customer has successfully completed an ABA swap test1 for non-WLCSP/BGA packages or chip isolation test for WLCSP/BGA packages to confirm the failure was caused by the Cypress device. Additional information to replicate and solve the customer issue in a timely manner will be required. Benefit of Change: By implementing this policy change, Cypress will better be able to respond to the confirmed issues customers are observing. This policy change is required due to the large percentage of NTF (No Trouble Found) results on USB failure analysis cases. Approximate Implementation Date: This change will be implemented effective with the date of this notification.
Description of Change: The purpose of this addendum is to add some missed part numbers in the affected parts list communicated in PCN 192501A. Cypress announced the qualification of Fab 25 (5204 East Ben White Boulevard, Austin, TX 78741, USA) as an additional wafer fab site with the Copper (Cu) Backend of Line (BEOL) process for the USB-SERIAL Bridge Controller products. This qualification is part of the flexible manufacturing initiative which allows Cypress to meet its delivery commitments in dynamic and changing market conditions. Benefit of Change: Qualification of alternate manufacturing sites is part of the ongoing flexible manufacturing initiative announced by Cypress. The goal of the flexible manufacturing initiative is to provide the means for Cypress to continue to meet delivery commitments through dynamic, changing market conditions.
Addendum to PIN195102 - Manufacturing Label and Packing Configuration Standardization Description of Change: The purpose of this addendum is to correct the date from January 20, 2019 to January 20, 2020, in the "3rd paragraph in the 'Description of Change' section. This notification is to inform customers that Cypress will be standardizing its manufacturing labels and tray/tube packing configuration. It may be recalled that the Cypress entity consolidation (following the merger with Spansion Corp) was announced via Product Information Notification PIN174801 in November 2017. As the next phase of the entity consolidation process, Cypress will be adapting a new manufacturing label format for all products and revising shipping configurations for select product shipped in trays and tubes.
Description of Change: Cypress has qualified an EIA standard carrier tape for select QFN packages at Cypress Philippines (CML, Gateway Business Park, SEPZA, Brgy., Javalera, General Trias, Cavite, Philippines). The new carrier tape meets the Cypress specification and demonstrates the same quality as the current carrier tape being used. Benefit of Change: This change is part of Cypress' continuous quality improvement to standardize tape and reel materials at Cypress Philippines.
Qualification of New Bill of Materials for QFN Pb-Free Packages Assembled at Cypress Philippines Description of Change: Cypress announces the qualification of new bill of materials (BOM) for QFN Pb-Free packages assembled at Cypress Philippines (CML, Gateway Business Park, SEPZA, Javalera, Gen. Trias Cavite, Philippines). These changes have been done to simplify the process flow or control resulting in better product quality, field reliability and continuity of supply. This in turn provides the means for Cypress to continue to meet our customers' requirements and meet our delivery commitments in dynamic market conditions. These products are ROHS compliant.
Description of Change: Cypress has qualified an EIA standard outline cover tape for all tape and reel shipment at Cypress Philippines (CML, Gateway Business Park, SEPZA, Brgy., Javalera, General Trias, Cavite, Philippines). The new cover tape meets the Cypress specification and demonstrates the same quality as the current cover tape.
Addendum to PCN192501 - Qualification of Fab 25 with the Copper (Cu) BEOL Process for the USB-Serial Bridge Controller Products Description of Change: The purpose of this addendum is to correct the data in Table 8 in the customer characterization report and to add some missed part numbers in the affected parts list communicated in PCN 192501.
Addendum to PCN190302 (Future PCN 64206) - Qualification of G700LA Mold Compound, Pure Sn Leadfinish and CuPdAu Wire for Select QFN Packages Assembled at ASE-KH Description of Change: The purpose of this addendum is to update the affected parts list communicated in the initial PCN190302. Cypress announced the qualification of G700LA mold compound, Pure Sn leadfinish and CuPdAu wire for select QFN packages assembled at Advanced Semiconductor Engineering-Kaohsiung (ASE-KH, 26 Chin 3rd Rd., 811, Nantze Export Processing Zone Kaohsiung, Taiwan, R.O.C.).
|No of Channels:||1|
|Supply Voltage:||1.71V to 5.5V|
|Operating Temp Range:||-40°C to +85°C|
|Storage Temperature Range:||-55°C to +100°C|
|No of Pins:||32|
|Moisture Sensitivity Level:||3|
|Mounting Method:||Surface Mount|
2500 per Tray