Manufacturer Part #
FPGA MACHXO3 Family 4300 Cells 65nm Technology 1.2V Automotive 121-Pin CSBGA
|Mfr. Name:||Lattice Semiconductor|
Lattice Semiconductor is providing this notification of a change to the Power Calculator tool that is used in Lattice Diamond 3.12 software (Release Date: December 8, 2020). This PCN covers one change to the calculation of the MCLK (oscillator) entry to the MISC tab of Power Calculator. This change affects the software only, and has no impact to silicon or hardware. Change Description:This change is a modification to how Power Calculator computes power for the MCLK when it is used. The power consumed by the used MCLK in Power Calculator will increase. The default setting of MCLK is to be used. Thus this change will affect the Power Calculator in instances when it is brought up in default settings (blank pattern), or in any Estimation or Calculation for non-default settings (user pattern) where MCLK is used. When the MCLK is unused, there will be no effect on Power Calculator. The magnitude of the power increase will vary depending on the voltage. For parts with a core VCC of 2.5v or 3.3v, the increase will be 15.5mW � 1mW for XO2, XO3L, and XO3LF. That increase will be 43.5mW � 1mW for XO3D, and 41.0mW � 1mW for Platform Manager 2. For parts with a core VCC of 1.2v, the increase will be 5.3mW � 1mW.
Alternate Additional Assembly / Test Supplier Qualification for Select Lattice Products.Lattice is providing this Product Change Notification (PCN) of our intent of using Advanced Semiconductor Engineering Inc., Kaohsiung (ASEK) as alternate assembly and test source for select Lattice Semiconductor products. Unless otherwise noted, there is no change in form, fit or function of the affected products.
Notification of Intent to Utilize an Alternate Qualified Assembly and Test Site for Select Flip Chip Ball Grid Array Devices Change Description The backend assembly and test of MachXO3, iCE5 and LIF-UC family devices in the flip chip BGA package is to be transferred from the Amkor Philippines (ATP) site to the Amkor Korea (ATK) site. ATP will discontinue the flip chip BGA backend assembly by the end of 2018, and has advised current customers to qualify affected devices at the ATK site.