Manufacturer Part #
IC RAM 16M PARALLEL 44TSOP2
|Mfr. Name:||Everspin Technologies|
Everspin is changing the die thickness from 3 mil to 4 mil for the 16Mb (x8) TSOP-44p Package from OSE. Additionally, the BLT1 and BLT3 material are changing from DAF to Epoxy, and the wire material is changing from 4N to 2N. Reason For Change Improved assembly process margin. Improved manufacturing efficiency and capacity at assembly site.