Manufacturer Part #
RF Diode from Microchip
PCN Status: Initial notificationPCN Type: Manufacturing ChangeDescription of Change: Qualification of a new fabrication site (Microchip - Fab 5) for various Microsemi products.Pre Change: Fabricated at Microchip Technology, Inc. - Lowell site (formerly Microsemi Lowell) using 3 and 4 inch wafers.Post Change:Fabricated at Microchip Technology Colorado - Fab 5 site using 6 inch wafers.Impacts to Data Sheet: NoneChange Impact:NoneReason for Change:To improve on-time delivery performance by qualifying Microchip Technology Colorado - Fab 5 as part of the integration of Microsemi and Microchip.Note: Lowell fab has a scheduled shut down target of August 2023.Change Implementation Status:In Progress*Estimated Qualification Completion Date:February 2024
September 4, 2020: Reissued final notification to add and correct pre and post change for -HS Parts.Description of Change:Implementation of Catalog Part Numbers (CPN) convention changes to select Microsemi products from the Lowell, MA location (cage code 50101).Pre Change: Using Microsemi CPN naming convention.Method 1:- Order catalog part number without line item 900942 reflected within sales order.- Receive bulk or tape and reel shipment.Method 2:- Order catalog part number with line item 900942 reflected within sales order.- Receive tape and reel shipment. Method 3:- Order existing Microsemi Ordering Part Number: MPxxxxx-xxx-HS- Receive Tape and reel shipmentPost Change: Using Microchip CPN naming convention. The /TR suffix used in a CPN indicates the tape and reel packing method is used.Method 1:- Order catalog part number without /TR suffix.- Receive bulk shipment.Method 2:- Order catalog part number with /TR suffix.- Receive tape and reel shipment.Method 3:- Order catalog part number without -HS and with /TR suffix (Microchip Ordering Part Number: MPxxxxx-xxx/TR) and Receive Tape and reel shipment, or - Order catalog part number without -HS (Microchip Ordering Part Number: MPxxxxx-xxx) and Receive bulk shipment.Reason for Change:To support the Microsemi integration with Microchip by implementing the Microchip catalog part naming convention.Change Implementation Status:In ProgressEstimated Implementation Date:August 15, 2020 (date code: 2033)
Description of Change: Integration of the Microsemi RFDS, CSAC and HVD PCN system with the Microchip PCN System for selected Microsemi RFDS, CSAC and HVD products within the Microsemi subsidiaries Microsemi Solutions Sdn.Bhd. As part of the Microsemi integration with Microchip, Microsemi will integrate from the current Product/Process Change. Notification (PCN) and End of Life (EOL) Notification system to the Microchip notification system.This integration will require that all Microsemi PCN users who wish to receive PCN via email to register on microchip.com starting August 23, 2020. Please complete PCN email registration prior to September 23, 2020 if you would like to continue to receive PCN via email. Users who do not register will not receive PCN via email but may view notifications by visiting the Microchip Product Change Notification web page (linked attached).Pre Change: Using Microsemi RFDS, CSAC and HVD PCN systemPost Change: Using Microchip PCN systemReason for Change: To support the Microsemi integration with Microchip by archiving the Microsemi RFDS, CSAC and HVD PCN system and providing customers with the Microchip PCN service for selected Microsemi RFDS, CSAC and HVD products.