Manufacturer Part #
CY8C4xx Series 128 kB Flash 16 kB RAM 48 MHz SMT 32-Bit PSoC®4 - QFN-56
|Standard Pkg:|| |
Product Variant Information section
260 per Tray
Subject: Minimum Order Quantity, Packing and Shipping Configuration Standardization for Non-Memory ProductsChange Type: Minor Description of Change: This notification is to inform customers that Cypress will be standardizing its Full Box Quantity to a sellable quantity in the market where it will be able to round the orders in increment of this full box quantity. It may be recalled that Cypress had implemented Manufacturing Label and Packing Configuration Standardization via Product Information Notification PIN195102 in December 2019. As part of the Cypress integration into Infineon Shipping Standard, Cypress will be adjusting Minimum Order Quantity (MOQ), Order Increment (OI) to align them with new Full Box Quantity for select parts shipped in trays and tubes. These changes will be implemented immediately at all Cypress in-house and qualified subcontractor locations. Please be advised that starting July 5, 2021, all new orders must follow these new Minimum Order Quantity (MOQ)/Order Increment (OI) and Cypress will start shipping orders in new full box quantity configuration. The existing orders can remain in old MOQ/OI through end of December 2021, or change orders requiring additional lines/quantities, whichever occurs first. The transition period where customers should expect to receive either current or new shipping configurations is expected to end in December 2021. Starting January 2022, all orders must conform with the new MOQ and any existing orders not yet in new MOQ must be changed by December 15, 2021. Benefit of Change: The change is part of Cypress' continuous improvement initiative, intended to provide Cypress the means to packaging flexibility and process standardization to match industry standards and reliably meet customer delivery requirements Approximate Implementation Date: This change will be implemented on July 05, 2021. Anticipated Impact: Cypress, an Infineon Technologies Company also recommends that customers take this opportunity to review these changes against current order profile since the change will align to Infineon shipping standard as we will move our Finished Goods inventory to Infineon's Distribution Centers in Singapore and Shanghai respectively. Customers should also update their MRP or order entry systems to reflect these changes.
Description of Change: Cypress announces the qualification of new bill of materials (BOM) for the premolded wettable flank 56-Lead QFN package (7x7x0.6mm) assembled at Cypress Philippines (Gateway Business Park, SEPZA, Javalera, Gen. Trias Cavite, Philippines). The new BOM is consistent with industry standards and results in improved product quality and reliability. The green and lead-free RoHS-compliant Kyocera KEG3000NAS mold compound is compatible with industry standard reflow temperatures for applicable package volume, thickness, and lead finish. The new die attach material is compatible with industry standard reflow conditions for applicable package volume, thickness, and lead finish. There is no change in the moisture sensitivity level (MSL). Benefit of Change: The qualification of the new bill of materials on existing qualified package and devices allows for an improvement in product quality and reliability.
Description of Change: Deca Technologies (DT) which is a qualified assembly/finish/test subcontractor for Cypress, has changed their name to nepes hayyim Corporation Inc. This change will not interrupt production of customers products. nepes hayyim Corporation will continue to manufacture customers products using the current manufacturing process at the same location which is 100 East Main Avenue 4024 Bi�an City, Bi�an Laguna, Philippines. There has been no change in the range of products and services offer, and the name change will not impact on ongoing and future business.
Description of Change: Cypress announces the qualification of Advanced Semiconductor Engineering Inc. (ASE-KH, No.47, Kaifa Road, N.E.P.Z. Kaohsiung City 811, Taiwan, R.O.C.) as an additional copper inductor (CUIN) process site for select QFN Pb-Free packages. ASE-KH is Cypress' existing manufacturing site for many other WLCSP (including RDL) products in high volume production mode. Benefit of Change: Qualification of alternate manufacturing sites is part of the ongoing flexible manufacturing initiative announced by Cypress. The goal of the flexible manufacturing initiative is to provide the means for Cypress to continue to meet delivery commitments through dynamic, changing market conditions.
Addendum to PIN195102 - Manufacturing Label and Packing Configuration Standardization Description of Change: The purpose of this addendum is to correct the date from January 20, 2019 to January 20, 2020, in the "3rd paragraph in the 'Description of Change' section. This notification is to inform customers that Cypress will be standardizing its manufacturing labels and tray/tube packing configuration. It may be recalled that the Cypress entity consolidation (following the merger with Spansion Corp) was announced via Product Information Notification PIN174801 in November 2017. As the next phase of the entity consolidation process, Cypress will be adapting a new manufacturing label format for all products and revising shipping configurations for select product shipped in trays and tubes.
Qualification of New Bill of Materials for QFN Pb-Free Packages Assembled at Cypress Philippines Description of Change: Cypress announces the qualification of new bill of materials (BOM) for QFN Pb-Free packages assembled at Cypress Philippines (CML, Gateway Business Park, SEPZA, Javalera, Gen. Trias Cavite, Philippines). These changes have been done to simplify the process flow or control resulting in better product quality, field reliability and continuity of supply. This in turn provides the means for Cypress to continue to meet our customers' requirements and meet our delivery commitments in dynamic market conditions. These products are ROHS compliant.
|Max Power Consumption:||16.5mA|
|Mounting Method:||Surface Mount|
260 per Tray