Manufacturer Part #
ARM Microcontrollers - MCU PSoC4
Cypress CY8C4247LQI-BL473T - Product Specification
Description of Change: Cypress announces the qualification of new bill of materials (BOM) for the premolded wettable flank 56-Lead QFN package (7x7x0.6mm) assembled at Cypress Philippines (Gateway Business Park, SEPZA, Javalera, Gen. Trias Cavite, Philippines). The new BOM is consistent with industry standards and results in improved product quality and reliability. The green and lead-free RoHS-compliant Kyocera KEG3000NAS mold compound is compatible with industry standard reflow temperatures for applicable package volume, thickness, and lead finish. The new die attach material is compatible with industry standard reflow conditions for applicable package volume, thickness, and lead finish. There is no change in the moisture sensitivity level (MSL). Benefit of Change: The qualification of the new bill of materials on existing qualified package and devices allows for an improvement in product quality and reliability.
Description of Change: Deca Technologies (DT) which is a qualified assembly/finish/test subcontractor for Cypress, has changed their name to nepes hayyim Corporation Inc. This change will not interrupt production of customers products. nepes hayyim Corporation will continue to manufacture customers products using the current manufacturing process at the same location which is 100 East Main Avenue 4024 Bi�an City, Bi�an Laguna, Philippines. There has been no change in the range of products and services offer, and the name change will not impact on ongoing and future business.
Description of Change: Cypress announces the qualification of Advanced Semiconductor Engineering Inc. (ASE-KH, No.47, Kaifa Road, N.E.P.Z. Kaohsiung City 811, Taiwan, R.O.C.) as an additional copper inductor (CUIN) process site for select QFN Pb-Free packages. ASE-KH is Cypress' existing manufacturing site for many other WLCSP (including RDL) products in high volume production mode. Benefit of Change: Qualification of alternate manufacturing sites is part of the ongoing flexible manufacturing initiative announced by Cypress. The goal of the flexible manufacturing initiative is to provide the means for Cypress to continue to meet delivery commitments through dynamic, changing market conditions.
Addendum to PIN195102 - Manufacturing Label and Packing Configuration Standardization Description of Change: The purpose of this addendum is to correct the date from January 20, 2019 to January 20, 2020, in the "3rd paragraph in the 'Description of Change' section. This notification is to inform customers that Cypress will be standardizing its manufacturing labels and tray/tube packing configuration. It may be recalled that the Cypress entity consolidation (following the merger with Spansion Corp) was announced via Product Information Notification PIN174801 in November 2017. As the next phase of the entity consolidation process, Cypress will be adapting a new manufacturing label format for all products and revising shipping configurations for select product shipped in trays and tubes.
Qualification of New Bill of Materials for QFN Pb-Free Packages Assembled at Cypress Philippines Description of Change: Cypress announces the qualification of new bill of materials (BOM) for QFN Pb-Free packages assembled at Cypress Philippines (CML, Gateway Business Park, SEPZA, Javalera, Gen. Trias Cavite, Philippines). These changes have been done to simplify the process flow or control resulting in better product quality, field reliability and continuity of supply. This in turn provides the means for Cypress to continue to meet our customers' requirements and meet our delivery commitments in dynamic market conditions. These products are ROHS compliant.
Description of Change: Cypress has qualified an EIA standard outline cover tape for all tape and reel shipment at Cypress Philippines (CML, Gateway Business Park, SEPZA, Brgy., Javalera, General Trias, Cavite, Philippines). The new cover tape meets the Cypress specification and demonstrates the same quality as the current cover tape.