Manufacturer Part #
CY8C4xx Series 128 kB Flash 16 kB RAM 48 MHz ARM Cortex-M0 32-Bit PSoC®4 -QFN-56
|Standard Pkg:|| |
Product Variant Information section
1 per Bulk
Description of Change: Deca Technologies (DT) which is a qualified assembly/finish/test subcontractor for Cypress, has changed their name to nepes hayyim Corporation Inc. This change will not interrupt production of customers products. nepes hayyim Corporation will continue to manufacture customers products using the current manufacturing process at the same location which is 100 East Main Avenue 4024 Bi�an City, Bi�an Laguna, Philippines. There has been no change in the range of products and services offer, and the name change will not impact on ongoing and future business.
Description of Change: Cypress announces the qualification of Advanced Semiconductor Engineering Inc. (ASE-KH, No.47, Kaifa Road, N.E.P.Z. Kaohsiung City 811, Taiwan, R.O.C.) as an additional copper inductor (CUIN) process site for select QFN Pb-Free packages. ASE-KH is Cypress' existing manufacturing site for many other WLCSP (including RDL) products in high volume production mode. Benefit of Change: Qualification of alternate manufacturing sites is part of the ongoing flexible manufacturing initiative announced by Cypress. The goal of the flexible manufacturing initiative is to provide the means for Cypress to continue to meet delivery commitments through dynamic, changing market conditions.
Addendum to PIN195102 - Manufacturing Label and Packing Configuration Standardization Description of Change: The purpose of this addendum is to correct the date from January 20, 2019 to January 20, 2020, in the "3rd paragraph in the 'Description of Change' section. This notification is to inform customers that Cypress will be standardizing its manufacturing labels and tray/tube packing configuration. It may be recalled that the Cypress entity consolidation (following the merger with Spansion Corp) was announced via Product Information Notification PIN174801 in November 2017. As the next phase of the entity consolidation process, Cypress will be adapting a new manufacturing label format for all products and revising shipping configurations for select product shipped in trays and tubes.
Qualification of New Bill of Materials for QFN Pb-Free Packages Assembled at Cypress Philippines Description of Change: Cypress announces the qualification of new bill of materials (BOM) for QFN Pb-Free packages assembled at Cypress Philippines (CML, Gateway Business Park, SEPZA, Javalera, Gen. Trias Cavite, Philippines). These changes have been done to simplify the process flow or control resulting in better product quality, field reliability and continuity of supply. This in turn provides the means for Cypress to continue to meet our customers' requirements and meet our delivery commitments in dynamic market conditions. These products are ROHS compliant.
Qualification of Fab 25 as an Additional Wafer Fab Site, Test 25 as an Additional Sort Site and ASE-Kaohsiung Taiwan as an Additional Assembly, Test and Finish Site for the PSoC� 4xx7 BLE and PSoC� 4xx8 BLE Product Family Description of Change: ASE-KH is a world-class manufacturing facility, qualified to build standard grade as well as automotive grade products in consistent with AEC-Q100. ASE-KH is certified to several international quality standards, including ISO/TS16949, OHSAS18001 and ANSI/ESD S20.20. The qualification of this facility will enable Cypress to tailor manufacturing operations to meet our customers' stringent quality and reliability requirements in our effort to continually provide world-class service.
Planned Qualification of Spansion Manufacturing Sites for Cypress ProductsDescription of Change:In concert with the recently announced merger between Cypress Semiconductor Corporation (Cypress) and Spansion Inc. (Spansion), Cypress announces plans to qualify proprietary SONOS Technology products at Spansion Fab 25 / Test 25 in Austin, Texas and BGA/TSOP-packaged products at the Spansion assembly facility in Bangkok, Thailand. These qualifications and implementations are expected to occur throughout 2015 and 2016. Once complete, the qualifications will be announced through regular PCNs.This is an advance notification and no immediate action is needed. Refer to the attached Supplier documentation for the complete schedule of the activity, PCN issue dates and shipment start dates.
|Max Power Consumption:||16.5mA|
|Mounting Method:||Surface Mount|
1 per Bulk