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Manufacturer Part #
CY8C6316BZI-BLF53
CY8C6xx Series 512 kB Flash 128 kB RAM 50 MHz 32-Bit PSoC®6 - BGA-116
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| Mfr. Name: | Cypress | ||||||||||
| Standard Pkg: | Product Variant Information section Available PackagingPackage Qty:1 per Box Mounting Method:Surface Mount | ||||||||||
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Cypress CY8C6316BZI-BLF53 - Product Specification
Shipping Information:
ECCN:
PCN Information:
Subject: Minimum Order Quantity, Packing and Shipping Configuration Standardization for Non-Memory ProductsChange Type: Minor Description of Change: This notification is to inform customers that Cypress will be standardizing its Full Box Quantity to a sellable quantity in the market where it will be able to round the orders in increment of this full box quantity. It may be recalled that Cypress had implemented Manufacturing Label and Packing Configuration Standardization via Product Information Notification PIN195102 in December 2019. As part of the Cypress integration into Infineon Shipping Standard, Cypress will be adjusting Minimum Order Quantity (MOQ), Order Increment (OI) to align them with new Full Box Quantity for select parts shipped in trays and tubes. These changes will be implemented immediately at all Cypress in-house and qualified subcontractor locations. Please be advised that starting July 5, 2021, all new orders must follow these new Minimum Order Quantity (MOQ)/Order Increment (OI) and Cypress will start shipping orders in new full box quantity configuration. The existing orders can remain in old MOQ/OI through end of December 2021, or change orders requiring additional lines/quantities, whichever occurs first. The transition period where customers should expect to receive either current or new shipping configurations is expected to end in December 2021. Starting January 2022, all orders must conform with the new MOQ and any existing orders not yet in new MOQ must be changed by December 15, 2021. Benefit of Change: The change is part of Cypress' continuous improvement initiative, intended to provide Cypress the means to packaging flexibility and process standardization to match industry standards and reliably meet customer delivery requirements Approximate Implementation Date: This change will be implemented on July 05, 2021. Anticipated Impact: Cypress, an Infineon Technologies Company also recommends that customers take this opportunity to review these changes against current order profile since the change will align to Infineon shipping standard as we will move our Finished Goods inventory to Infineon's Distribution Centers in Singapore and Shanghai respectively. Customers should also update their MRP or order entry systems to reflect these changes.
Addendum to PIN195102 - Manufacturing Label and Packing Configuration Standardization Description of Change: The purpose of this addendum is to correct the date from January 20, 2019 to January 20, 2020, in the "3rd paragraph in the 'Description of Change' section. This notification is to inform customers that Cypress will be standardizing its manufacturing labels and tray/tube packing configuration. It may be recalled that the Cypress entity consolidation (following the merger with Spansion Corp) was announced via Product Information Notification PIN174801 in November 2017. As the next phase of the entity consolidation process, Cypress will be adapting a new manufacturing label format for all products and revising shipping configurations for select product shipped in trays and tubes.
Description of Change: Cypress is pleased to announce the release of the latest silicon version for the CY8C63XXXXX family of devices. The CY8C63XXXXX devices will update from the current version *C to version *D. Benefit of Change: A will result in improved performance and robustness for the CY8C63XXXXX family of devices.
Part Status:
Cypress CY8C6316BZI-BLF53 - Technical Attributes
| Mounting Method: | Surface Mount |
Available Packaging
Package Qty:
1 per Box
Mounting Method:
Surface Mount