Manufacturer Part #
RF System on a Chip - SoC Bluetooth BLE and IEEE 802.15.4
|Standard Pkg:|| |
Product Variant Information section
490 per Tray
Addendum to PIN195102 - Manufacturing Label and Packing Configuration Standardization Description of Change: The purpose of this addendum is to correct the date from January 20, 2019 to January 20, 2020, in the "3rd paragraph in the 'Description of Change' section. This notification is to inform customers that Cypress will be standardizing its manufacturing labels and tray/tube packing configuration. It may be recalled that the Cypress entity consolidation (following the merger with Spansion Corp) was announced via Product Information Notification PIN174801 in November 2017. As the next phase of the entity consolidation process, Cypress will be adapting a new manufacturing label format for all products and revising shipping configurations for select product shipped in trays and tubes.
Qualification of Cypress Thailand as an Additional Assembly Site and PTI-SG as an Additional Wafer Bumping Site for Select 49-Ball Flip Chip BGA (FCBGA) IoT Products Description of Change: Cypress announces the qualification of Cypress Thailand (BKK- 229, MOO 4, Changwattana Road Pakkred, Nonthaburi 11120 Thailand) as an additional assembly site for select 49-Ball Flip Chip BGA (FCBGA) IoT products. Cypress also announces the qualification of Powertech Technology Inc. Singapore (PTI-SG - 12 Ang Mo Kio Street 65, Singapore 569060) as an additional wafer bumping site for 40nm LP (Low Power) technology.
CVE-2018-19860 - Vulnerability in Specific Cypress Bluetooth Controllers Containing Certain Firmware Versions Description of Alert: At a recent conference in Germany, researchers publicized a vulnerability in specific Cypress Bluetooth controllers containing certain firmware versions. The vulnerable Bluetooth controllers are missing a parameter range check, and as a result, hackers can send illegitimate link management protocol (LMP) messages (over the air) from one compromised device to another vulnerable device. These LMP messages may or may not be compliant with Bluetooth standards, and can cause unexpected behavior and potentially crash the target device. This range check issue was eliminated in the firmware master branch prior to 2015. Bluetooth controllers with ROM images generated from a 2014 or earlier master branch may be affected. Bluetooth controllers with ROM images based on a 2015 or later master branch are not affected.
Wireless Products Failure Analysis Policy Change Description of Change: Cypress is changing its policy for failure analysis of wireless products to only accept units for failure analysis if the customer has successfully completed an ABA swap test1 to confirm the failure has been isolated to the Cypress device. Benefit of Change: By implementing this policy change, Cypress will better be able to service the confirmed issues customers are observing. This policy change is required due to the large percentage of NTF (No Trouble Found) results on wireless failure analysis cases.
|Supply Voltage:||1.2V to 3.3V|
|Operating Temp Range:||-30°C to +85°C|
|Storage Temperature Range:||-40°C to +150°C|
|Mounting Method:||Surface Mount|
490 per Tray