Manufacturer Part #
Bluetooth, BLE and IEEE 802.15.4
Subject :Company Name Change from Powertech Technology (Singapore) Pte. Ltd. (PTI-SG) to United Test and Assembly Center Pte Ltd Singapore (UTAC-SG). Reason:Powertech Technology Inc. Singapore (PTI-SG), which is a qualified bumping subcontractor for Cypress, was acquired and changing their name to United Test and Assembly Center Pte Ltd Singapore (UTAC-SG - 12 Ang Mo Kio Street 65, Singapore 569060) on January, 2021.
Subject: Minimum Order Quantity, Packing and Shipping Configuration Standardization for Non-Memory ProductsChange Type: Minor Description of Change: This notification is to inform customers that Cypress will be standardizing its Full Box Quantity to a sellable quantity in the market where it will be able to round the orders in increment of this full box quantity. It may be recalled that Cypress had implemented Manufacturing Label and Packing Configuration Standardization via Product Information Notification PIN195102 in December 2019. As part of the Cypress integration into Infineon Shipping Standard, Cypress will be adjusting Minimum Order Quantity (MOQ), Order Increment (OI) to align them with new Full Box Quantity for select parts shipped in trays and tubes. These changes will be implemented immediately at all Cypress in-house and qualified subcontractor locations. Please be advised that starting July 5, 2021, all new orders must follow these new Minimum Order Quantity (MOQ)/Order Increment (OI) and Cypress will start shipping orders in new full box quantity configuration. The existing orders can remain in old MOQ/OI through end of December 2021, or change orders requiring additional lines/quantities, whichever occurs first. The transition period where customers should expect to receive either current or new shipping configurations is expected to end in December 2021. Starting January 2022, all orders must conform with the new MOQ and any existing orders not yet in new MOQ must be changed by December 15, 2021. Benefit of Change: The change is part of Cypress' continuous improvement initiative, intended to provide Cypress the means to packaging flexibility and process standardization to match industry standards and reliably meet customer delivery requirements Approximate Implementation Date: This change will be implemented on July 05, 2021. Anticipated Impact: Cypress, an Infineon Technologies Company also recommends that customers take this opportunity to review these changes against current order profile since the change will align to Infineon shipping standard as we will move our Finished Goods inventory to Infineon's Distribution Centers in Singapore and Shanghai respectively. Customers should also update their MRP or order entry systems to reflect these changes.
Addendum to PIN195102 - Manufacturing Label and Packing Configuration Standardization Description of Change: The purpose of this addendum is to correct the date from January 20, 2019 to January 20, 2020, in the "3rd paragraph in the 'Description of Change' section. This notification is to inform customers that Cypress will be standardizing its manufacturing labels and tray/tube packing configuration. It may be recalled that the Cypress entity consolidation (following the merger with Spansion Corp) was announced via Product Information Notification PIN174801 in November 2017. As the next phase of the entity consolidation process, Cypress will be adapting a new manufacturing label format for all products and revising shipping configurations for select product shipped in trays and tubes.
Qualification of Cypress Thailand as an Additional Assembly Site and PTI-SG as an Additional Wafer Bumping Site for Select 49-Ball Flip Chip BGA (FCBGA) IoT Products Description of Change: Cypress announces the qualification of Cypress Thailand (BKK- 229, MOO 4, Changwattana Road Pakkred, Nonthaburi 11120 Thailand) as an additional assembly site for select 49-Ball Flip Chip BGA (FCBGA) IoT products. Cypress also announces the qualification of Powertech Technology Inc. Singapore (PTI-SG - 12 Ang Mo Kio Street 65, Singapore 569060) as an additional wafer bumping site for 40nm LP (Low Power) technology.
CVE-2018-19860 - Vulnerability in Specific Cypress Bluetooth Controllers Containing Certain Firmware Versions Description of Alert: At a recent conference in Germany, researchers publicized a vulnerability in specific Cypress Bluetooth controllers containing certain firmware versions. The vulnerable Bluetooth controllers are missing a parameter range check, and as a result, hackers can send illegitimate link management protocol (LMP) messages (over the air) from one compromised device to another vulnerable device. These LMP messages may or may not be compliant with Bluetooth standards, and can cause unexpected behavior and potentially crash the target device. This range check issue was eliminated in the firmware master branch prior to 2015. Bluetooth controllers with ROM images generated from a 2014 or earlier master branch may be affected. Bluetooth controllers with ROM images based on a 2015 or later master branch are not affected.