Manufacturer Part #
IC RF SWITCH SP6T 3.8GHZ
Introduction of new mold compound for dedicated ATSLP packages from Infineon Technologies (Malaysia) Sdn. Bhd.To further ensure our product performance the new mold compound will be introduced.No impact on electrical performance. Quality and reliability verified by qualification. There is no change in form, fit and function.
Change of lead-frame supplier affecting ATSLP packages from Infineon Technologies (Malaysia) Sdn. Bhd. Reason:Infineon supplier AAPM has announced discontinuation of its lead-frame business by end of 2019.Change to Infineon lead-frame supplier QDOS, who is already active for other Infineon components, to assure supply continuity.