Manufacturer Part #
RF Microcontrollers - MCU Bluetooth, BLE and IEEE 802.15.4
Addendum to PIN195102 - Manufacturing Label and Packing Configuration Standardization Description of Change: The purpose of this addendum is to correct the date from January 20, 2019 to January 20, 2020, in the "3rd paragraph in the 'Description of Change' section. This notification is to inform customers that Cypress will be standardizing its manufacturing labels and tray/tube packing configuration. It may be recalled that the Cypress entity consolidation (following the merger with Spansion Corp) was announced via Product Information Notification PIN174801 in November 2017. As the next phase of the entity consolidation process, Cypress will be adapting a new manufacturing label format for all products and revising shipping configurations for select product shipped in trays and tubes.
Description of Change: Cypress has qualified an EIA standard outline cover tape for all tape and reel shipment at Cypress Philippines (CML, Gateway Business Park, SEPZA, Brgy., Javalera, General Trias, Cavite, Philippines). The new cover tape meets the Cypress specification and demonstrates the same quality as the current cover tape.
Wireless Products Failure Analysis Policy Change Description of Change: Cypress is changing its policy for failure analysis of wireless products to only accept units for failure analysis if the customer has successfully completed an ABA swap test1 to confirm the failure has been isolated to the Cypress device. Benefit of Change: By implementing this policy change, Cypress will better be able to service the confirmed issues customers are observing. This policy change is required due to the large percentage of NTF (No Trouble Found) results on wireless failure analysis cases.