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ON Semiconductor


April 22 - May 2, 2019

2019 Power Seminar
5 dates & locations | US / Brazil / Mexico



Staying up to date on the latest advancements in power supply design is one of the many challenges engineers face today. To help designers meet this challenge, we are pleased to host the 2019 Power Seminar in April and May, located in the cities of Seattle, San Jose, Minneapolis, Sao Paulo and Mexico City.

One day to learn comprehensive "hands-on" real-world application examples

The Power seminar is a one-day seminar providing rich technical and practical presentations that combine new, advanced power supply concepts, tutorial review of basic design principles, and "hands-on" real-world application examples.

What should you expect?

Attendees will receive in-depth theoretical and practical discussions on each topic and pros and cons of different solutions to improve energy efficiency and system performance. Each of the presentations is accompanied by a technical paper with full in-depth treatment of the topic for reference.

Who will benefit from the seminar?

The seminars are ideal for engineers looking for the latest advancements in power supply design, as well as those looking for a refresher. Space is limited. Register today and meet our power experts in your city!


Date City Location Register
April 22, 2019 Seattle, Washington Sheraton Bellevue Hotel
100 112th Ave NE
Bellevue, WA 98004
April 23, 2019 San Jose, California Santa Clara Marriott
2700 Mission College Blvd
Santa Clara, CA 95054
April 25, 2019 Minneapolis, Minnesota Minneapolis Airport Marriott
2020 American Boulevard East
Bloomington, Minnesota 55425 USA
April 30, 2019 Sao Paulo, Brazil Hotel Novotel Sao Paulo Center Norte
Avenida Zaki Narchi, 500
Vila Guilherme - CEP 02029-000
São Paulo BRAZIL
May 2, 2019 Mexico City, Mexico Camino Real Aeropuerto Mexico
Puerto Mexico
80 Col Penon de los Banos
Mexico City. 15520



Agenda Workshop Speaker Description
8:30 - 9:00 Registration & Coffee    
9:00 - 10:00 The Quest for Power Density with GaN Steve Mappus – Principal Applications Engineer, ON Semiconductor In this paper and corresponding presentation we endeavor on a journey connecting these pieces of the puzzle to obtain high power density. We will take a look at the latest trends of power supply design, technological benefits and cost advantages of designing for high power density and how the latest semiconductor technologies – primarily GaN power switches – can help us to reach our ultimate goal of a high efficiency, high performance, high reliability and low cost solution. Important details on critical characteristics of GaN devices, layout and drive requirements and application examples with waveforms will add practical aspects to the discussion.
10:00 - 11:00 PFC: Bridgeless vs. Interleaved Bryan McCoy – Applications Engineer, ON Semiconductor The topic shows in a first step, that the control scheme can help to optimize the efficiency over the load range while reducing the cost by a multi-mode concept. In a second step, the architecture aspect will be considered with in particular the bridgeless and interleaved approaches. Respective merits of these solutions will be compared in a 300-W, wide-mains application.
11:00 - 11:10 Break    
11:10 - 12:10 Control Loop Design Didier Balocco – EMEA Power Solution Group Technical Marketing Engineer, ON Semiconductor A simple methodology is shown, applied to measure and optimize the control loop of a switching system. After a brief introduction to control loop theory and stability criteria, the evaluation of such system is explained. The use of a PWM simulation model is shown in practice to predict loop stability, together with a quick overview of obtainable results. A straightforward method to implement control loop measurement on a real environment is presented, followed by an optimization method using standard calculation-tools.
12:10 - 1:30 Lunch & Expo    
1:30 - 2:00 Accelerating Evaluation, Simplifying Design   An overview of newly-launched Strata Developer Studio design support tool.
2:00 - 3:00 Design Review: Active Clamp Flyback Topology for High Density USB-PD Power Supply Bryan McCoy – Applications Engineer, ON Semiconductor You will learn about ACF operation, the problem of light load efficiency & standby power and how it can be solved by the NCP1568. Furthermore, key component selection along with the equations for transformer design will be presented. Finally the performance data of a 65 W ultra-high density active clamp flyback board for an USB-PD application is reviewed.
3:00 - 3:10 Break    
3:10 - 3:55 Physically Based, Scalable SPICE Modeling Methodologies for Modern Power Electronic Devices Didier Balocco – EMEA Power Solution Group Technical Marketing Engineer, ON Semiconductor This paper proposes novel physical and scalable SPICE models for power electronic semiconductors including wide bandgap devices. The models are based on process and layout parameters, enabling design optimization through a direct link between SPICE, physical design, and process technology. The models are used as a key design component during technology development and for the proliferation of new products.
3:55 - 4:55 Design with SiC MOSFETs Steve Mappus – Principal Applications Engineer, ON Semiconductor This presentation show detail characteristics of SiC MOSFETs that make them well suited for high-voltage, high-speed, power applications. Critical design requirements related to optimal gate drive design for maximizing SiC switching performance will be described. The task of designing an adequate gate drive circuit is simplified by a high performance, SiC gate driver IC which will be introduced.