Manufacturer Part #
DSPIC33EP64MC506-E/PT
dsPIC33EP Series 8 kB RAM 64 kB Flash 16-Bit Digital Signal Controller - TQFP-64
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| Mfr. Name: | Microchip | ||||||||||
| Standard Pkg: | Product Variant Information section Available PackagingPackage Qty:160 per Tray Package Style:TQFP-64 Mounting Method:Surface Mount | ||||||||||
| Date Code: | |||||||||||
Microchip DSPIC33EP64MC506-E/PT - Product Specification
Shipping Information:
ECCN:
PCN Information:
*** Update for PCN 115312 ***Description of Change:Qualification of QMI519 as a new die attach material and CuPdAu as a new bond wire material for various products available in PLCC, QSOP, SOIC, SOIJ, SSOP, TSSOP, MQFP, TQFP, DFN, QFN, QFN-S, SQFN, TDFN, UDFN, UQFN, VDFN, VQFN, WQFN and TQFP packages assembled at MP3A, MTAI and MMT sites.Reason for Change:To improve manufacturability by qualifying QMI519 as a new die attach to standardize the use of PFAS free material and CuPdAu as a new bond wire material.Estimated First Ship Date:September 03, 2025 (date code: 2536)Revision History:July 22, 2025: Issued final notification.August 15, 2025: Re-issued the final notification to update the qualification report list, which now includes either a link to the qual report or an attached PDF file for each CCB. Updated the affected CPN list to removed EOL'ed CPNS: ATECC608A-MAHLG-T, ATECC608A-MAHVL-T, ATECC608A-MAHVM-T, ATECC508A-MAHPH-S, ATECC508A-MAHUW-T, ATECC608B MAH5O-T, ATECC508A-MAHKN-T, ATECC608B-MAHAF-S, ATECC508A-MAHKN-S, ATECC508A-MAH1A-T, ATECC608A-MAH4K-T, ATECC608A-MAH3P-T, ATECC608A MAH3Q-S, ATECC608A-MAH4W-T, ATECC608A-MAHAC-S, ATECC608A-MAHD3-S, ATECC608A-MAHGA-T, ATECC608A-MAHGX-T, ATECC508A-MAH2E-T, ATECC608A MAH2B-T, ATECC608A-MAH2G-S, ATECC608A-MAHT2-B, ATECC508A-MAH1C-S, ATECC508A-MAH1Q-S, ATECC508A-MAH1Q-T, ATECC608A-MAH1G-S, ATECC608A MAH1G-T, ATECC608A-MAH1K-S, ATECC508A-MAHWW-S, ATECC508A-MAHWW-T, ATECC608B-MAHAK-S, ATECC608B-MAHPA-T, ATECC608B-MAHSB-T, ATECC608B MAHSC-T, ATECC608A-MAH2U-T, ATECC608A-MAH2V-S, ATECC608A-MAH2X-S, ATECC608A-MAH2Y-S, ATECC608A-MAH3J-T and ATECC608A-MAH1W-T.September 18, 2025: Re-issued the final notification to add PFAS Elimination and Die Attach Explanation file and updated the affected CPN list to remove ATMEGA8535L-8JU, AT89LP6440-20JU, X34070T-H/ST, LX34050QPW-TR, LX3302AQPW-TR-EASY, LX3302AQPW-TR-C01, LX34311T-H/ST, LX34070AT-H/ST, LX34070-H/ST, LX34050QPW, LX3302AQPW-EASY, LX34070T-H/STVAO, LX3302AQPW-TR, LX34050QPW-TR-VAO, LX3302AQPW-TR-GM, LX34311T-H/STVAO, LX34070AT-H/STVAO, LX34070-H/STVAO, LX3302AQPW and LX34050QPW-VAO.
*****FPCN114582 UPDATE/MATERIAL CHANGEQualification of QMI519 as a new die attach material and CuPdAu as a new bond wire material for various products available in PLCC, QSOP, SOIC, SOIJ, SSOP, TSSOP, MQFP, TQFP, DFN, QFN, QFN-S, SQFN, TDFN, UDFN, UQFN, VDFN, VQFN, WQFN and TQFP packages assembled at MP3A, MTAI and MMT sites.*Re-issued the final notification to update the qualification report list, which now includes either a link to the qual report or an attached PDF file for each CCB. Updated the affected CPN list to removed EOL'ed CPNS: ATECC608A-MAHLG-T, ATECC608A-MAHVL-T, ATECC608AMAHVM-T, ATECC508A-MAHPH-S, ATECC508A-MAHUW-T, ATECC608B-MAH5O-T, ATECC508AMAHKN-T, ATECC608B-MAHAF-S, ATECC508A-MAHKN-S, ATECC508A-MAH1A-T, ATECC608AMAH4K-T, ATECC608A-MAH3P-T, ATECC608A-MAH3Q-S, ATECC608A-MAH4W-T, ATECC608AMAHAC-S, ATECC608A-MAHD3-S, ATECC608A-MAHGA-T, ATECC608A-MAHGX-T, ATECC508AMAH2E-T, ATECC608A-MAH2B-T, ATECC608A-MAH2G-S, ATECC608A-MAHT2-B, ATECC508AMAH1C-S, ATECC508A MAH1Q-S, ATECC508A-MAH1Q-T, ATECC608A-MAH1G-S, ATECC608AMAH1G-T, ATECC608A-MAH1K-S, ATECC508A-MAHWW-S, ATECC508A-MAHWW-T, ATECC608B-MAHAK-S, ATECC608B-MAHPA-T, ATECC608B-MAHSB-T, ATECC608B-MAHSC-T,ATECC608A MAH2U-T, ATECC608A-MAH2V-S, ATECC608A-MAH2X-S, ATECC608A-MAH2Y-S, ATECC608A-MAH3J-T and ATECC608A-MAH1W-T.
Description of Change:Qualification of QMI519 as a new die attach material and CuPdAu as a new bond wire material for various products available in PLCC, QSOP, SOIC, SOIJ, SSOP, TSSOP, MQFP, TQFP, DFN, QFN, QFN-S, SQFN, TDFN, UDFN, UQFN, VDFN, VQFN, WQFN and TQFP packages assembled at MP3A, MTAI and MMT sites.Reason for Change:To improve manufacturability by qualifying QMI519 as a new die attach to standardize the use of PFAS free material and CuPdAu as a new bond wire material.September 03, 2025 (date code: 2536)
Description of Change:Qualification of Microchip Technology Gresham ? Fab 4 (GRTM) as an additional fabrication site for selected dsPIC33EP128xx, dsPIC33EP256xx, dsPIC33EP32xx, dsPIC33EP512xx, DSPIC33EP64xx, PIC24EP128GP2xx, PIC24EP128MC2xx, PIC24EP256GP2xx, PIC24EP256MC2xx, PIC24EP32GP2xx, PIC24EP32MC2xx, PIC24EP512GP2xx, PIC24EP512MC2xx, PIC24EP64GP2xx and PIC24EP64MC2xx device families available in various packages.Reason for Change:To improve on-time delivery performance by qualifying Microchip Technology Gresham ? Fab 4 (GRTM) as an additional fab assembly site.
Revision History:March 9, 2023: Issued initial notification.January 29, 2024: Issued final notification. Updated the affected parts list. Updated notification subject, description of change, and qual title accordingly. Provided estimated first ship date to be on January 31, 2024.February 8, 2024: Re-issued final notification. Updated PCN title from initial notice to final notice. Description of Change:Qualification of Microchip Technology Gresham ? Fab 4 (GRTM) as an additional fabrication site for selected DSPIC33EPxxxGPxxx, DSPIC33EPxxxMCxxx, PIC24EPxxxGPxxx, and PIC24EPxxxMCxxx device families available in various packages.Reason for Change:To improve on-time delivery performance by qualifying Microchip Technology Gresham ? Fab 4 (GRTM) as an additional fab assembly site.
Revision History:March 9, 2023: Issued initial notification.January 29, 2024: Issued final notification. Updated the affected parts list. Updated notification subject, description of change, and qual title accordingly. Provided estimated first ship date to be on January 31, 2024.Description of Change:Qualification of Microchip Technology Gresham ? Fab 4 (GRTM) as an additional fabrication site for selected DSPIC33EPxxxGPxxx, DSPIC33EPxxxMCxxx, PIC24EPxxxGPxxx, and PIC24EPxxxMCxxx device families available in various packages.Pre and Post Change Summary: See attachedmpacts to Data Sheet:NoneChange ImpactNoneReason for Change:To improve on-time delivery performance by qualifying Microchip Technology Gresham ? Fab 4 (GRTM) as an additional fab assembly site.Change Implementation Status:In ProgressEstimated First Ship Date:January 31, 2024 (date code: 2405)Note: Please be advised that after the estimated first ship date customers may receive pre and post change parts.Due to unforeseen circumstances, that are out of Microchip?s control, full qualification will be made available as soon as it is approved which may be after the estimated first ship date so that Microchip can maintain continuity of supply and not disrupt customer orders.Time Table Summary: see attached
Microchip has released a new Errata for the dsPIC33EPXXXGP50X, dsPIC33EPXXXMC20X/50X, and PIC24EPXXXGP/MC20X Family Silicon Errata and Data Sheet Clarification of devices. If you are using one of these devices please read the document located at dsPIC33EPXXXGP50X, dsPIC33EPXXXMC20X/50X, and PIC24EPXXXGP/MC20X Family Silicon Errata and Data Sheet Clarification.Notification Status: FinalDescription of Change: Updated silicon issue 30.Impacts to Data Sheet: NoneReason for Change: To Improve Productivity.Change Implementation Status: CompleteDate Document Changes Effective: 25 May 2023NOTE: Please be advised that this is a change to the document only the product has not been changed.
Description of Change:Qualification of Microchip Technology Gresham – Fab 4 (GRTM) as an additional fabrication site for HA4583T-I/PT, HA4584T-I/PT catalog part numbers (CPN) and selected HA7619xxx, DSPIC33EPxxxGPxxx, DSPIC33EPxxxMCxxx, PIC24EPxxxGPxxx, and PIC24EPxxxMCxxx device families available in various packages.Reason for Change:To improve on-time delivery performance by qualifying Microchip Technology Gresham – Fab 4 (GRTM) as an additional fab assembly site.
Part Status:
Microchip DSPIC33EP64MC506-E/PT - Technical Attributes
| Family Name: | dsPIC33EP |
| Core Processor: | dsPIC |
| Program Memory Type: | Flash |
| Flash Size (Bytes): | 64kB |
| RAM Size: | 8kB |
| Speed: | 60MHz |
| No of I/O Lines: | 53 |
| InterfaceType / Connectivity: | CAN/IrDA/I2C/LIN/QEI/SPI/UART |
| Peripherals: | POR/PWM/Watchdog |
| Number Of Timers: | 5 |
| Supply Voltage: | 3V to 3.6V |
| Operating Temperature: | -40°C to +125°C |
| On-Chip ADC: | 16-chx10-bit |
| Watchdog Timers: | 1 |
| Package Style: | TQFP-64 |
| Mounting Method: | Surface Mount |
Features & Applications
The DSPIC33EP64MC506-E/PT is a 16-bit DSC with 64 KB flash. This digital signal controller features a 70 MIPS dsPIC® DSC core with integrated DSP and enhanced on-chip peripherals.
It enables the design of high-performance, precision motor control systems that are more energy efficient, quieter in operation, have a great range and extended life. They can be used to control brushless DC, permanent magnet synchronous, AC induction and stepper motors. These devices are ideal for high-performance general purpose applications
Features:
- Core: 16-bit dsPIC33E/PIC24E CPU
- Code-efficient (C and Assembly) architecture
- Two 40-bit wide accumulators
- Single-cycle (MAC/MPY) with dual data fetch
- Clock Management
- 0.9% internal oscillator
- Programmable PLLs and oscillat
- Power Management
- Low-power management modes (Sleep, Idle, Doze)
- Integrated Power-on Reset and Brown-out Reset
- High-Speed PWM
- Up to three PWM pairs with independent timing
- Dead time for rising and falling edges
- 7.14 ns PWM resolution
- Advanced Analog Features
- ADC module:
- Configurable as 10-bit, 1.1 Msps with four S&H or 12-bit, 500 ksps with one S&H
- Six analog inputs on 28-pin devices and up to 16 analog inputs on 64-pin devices
- Flexible and independent ADC trigger sources
- Up to three Op amp/Comparators with direct connection to the ADC module:
- Additional dedicated comparator
- Programmable references with 32 voltage points
- ADC module:
- Timers/Output Compare/Input Capture
- Four IC modules
- Peripheral Pin Select (PPS) to allow function remap
- Peripheral Trigger Generator (PTG) for scheduling complex sequences
- Communication Interfaces
- Two UART modules (17.5 Mbps)
- With support for LIN 2.0 protocols and IrDA®
- Two 4-wire SPI modules (15 Mbps)
- ECAN™ module (1 Mbaud) CAN 2.0B support
- Two I2C™ modules (up to 1 Mbaud) with SMBus support
- Two UART modules (17.5 Mbps)
- Direct Memory Access (DMA)
- 4-channel DMA with user-selectable priority arbitration
- UART, SPI, ADC, ECAN, IC, OC, and Timers
- Input/Output
- Sink/Source 15 mA or 10 mA, pin-specific for standard VOH/VOL, up to 22 or 14 mA, respectively for non-standard VOH1
- 5V-tolerant pins
Available Packaging
Package Qty:
160 per Tray
Package Style:
TQFP-64
Mounting Method:
Surface Mount