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Manufacturer Part #
24C00/SN
128b (16 x 8) I²C 400 kHz 3.5 µs Surface Mont EEPROM Memory IC - SOIC-8
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| Mfr. Name: | Microchip | ||||||||||
| Standard Pkg: | Product Variant Information section Available PackagingPackage Qty:100 per Tube Package Style:TSSOP-8 Mounting Method:Surface Mount | ||||||||||
| Date Code: | |||||||||||
Microchip 24C00/SN - Product Specification
Shipping Information:
ECCN:
PCN Information:
Description of Change: Qualification of Microchip Technology Gresham ? Fab 4 (GRTM) as a new fabrication location for the selected 24AA00xx, 24AA65, 24C00, 24C65, 24LC00, 24LC21xx, 24LC22A, 24LC65, 24LCS21A, 24LCS22A, 25AA040, 25AA080, 25AA160, 25C040, 25C080, 25C160, 25LC040, 25LC080, 25LC160, 93AA46, 93AA56, 93AA66, 93AA76, 93AA86, 93C46B, 93C56, 93C66xx, 93C76, 93C86, 93LC46xx, 93LC56, 93LC66xx, 93LC76 and 93LC86 device families of 77k technology available in various packages.Reason for Change: To improve manufacturability and on time delivery performance by qualifying a new fabrication location (GRTM - FAB 4), which is a Microchip-owned facility that offers significant expansion potential to better meet future client demand.
Revision History:February 7, 2022: Issued final notification.April 6, 2022: Re-issuance of PCN to update the affected CPN list. Update the estimated first shipment date on March 30, 2022.Description of Change:Qualification of 3280 die attach material and new lead frame design for selected products available in 8L SOIC package assembled at MMT assembly site.Pre and Post Change Summary: See attachedImpacts to Data Sheet:NoneChange ImpactNoneReason for Change:To improve productivity by qualifying new lead frame design and die attach material.Change Implementation Status:In ProgressEstimated First Ship Date:March 30, 2022 (date code: 2214)Note: Please be advised that after the estimated first ship date customers may receive pre and post change parts.Time Table Summary: See attached
CCB 4993 Final Notice: Qualification of 3280 die attach material and new lead frame design for selected products available in 8L SOIC package assembled at MMT assembly site.PCN Type: Manufacturing ChangeDescription of Change:Qualification of 3280 die attach material and new lead frame design for selected products available in 8L SOIC package assembled at MMT assembly site.Impacts to Data Sheet: NoneChange Impact: NoneReason for Change:To improve productivity by qualifying new lead frame design and die attach material.Change Implementation Status: In ProgressEstimated First Ship Date: February 28, 2022 (date code: 2210)
NOTICE WITHDRAWALPCN Status: Cancellation of Notification.Reason for Change:Microchip has decided to not qualify a new lead frame design for selected products available in 8L SOIC package using 8390A die attach and palladium coated copper with gold flash (CuPdAu) bond wire material assembled at MMT assembly site.Revision History:February 09, 2021: Issued initial notification.February 01, 2022: Issued cancellation notification.
Part Status:
Microchip 24C00/SN - Technical Attributes
| Memory Density: | 128b |
| Memory Organization: | 16 x 8 |
| Supply Voltage-Nom: | 4.5V to 5.5V |
| Supply Current: | 2mA |
| Clock Frequency-Max: | 400kHz |
| Write Cycle Time-Max (tWC): | 4ms |
| Data Retention: | 200 yr |
| Interface Type: | 2-Wire |
| Access Time-Max: | 3.5µs |
| Operating Temp Range: | 0°C to 70°C |
| No of Terminals: | 8 |
| Package Style: | TSSOP-8 |
| Mounting Method: | Surface Mount |
Available Packaging
Package Qty:
100 per Tube
Package Style:
TSSOP-8
Mounting Method:
Surface Mount