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Manufacturer Part #
ATECC508A-SSHDA-B
Descarga los modelos CAD de este producto. Más información sobre SnapMagic.
100 por Tube
SOIC-8
Surface Mount
Información de envío:
Código HTS:
ECCN:
Información del CP:
Product Category: Crypto Authentication, Crypto Memory, MemoryDescription of Change: Implement new packing materials and packing changes for AT34C02D, AT24C08D, AT24HC02C, AT88SC0104CA, AT88SC1616C, AT88SC0404CA, AT24MAC602, ATSHA204A, ATECC608A, ATECC508A, AT93C66B, ATECC108A, ATECC608C, AT24C16C, AT88SC0808CA, AT25160B, AT25080B, 25CS160, 24LC64, AT24C01C, AT24C04C, AT24C128C, AT24C04D, 24AA16H, AT24C08C, 24AA02H, 24LC04B, 24LC16B, AT93C56B, 24AA04H, 24AA01H, 24LC04BH, 24LC02BH, 24LC01BH, 25AA640A, 25LC640A, AT93C46E, 25CS640, AT24CM01, AT24C256C, 24AA256, AT24C512C, 24AA512, 24LC512, AT24C02C, AT25320B, 24LC256, 24FC256, 24FC512, AT24CM02, AT24C64B, AT24HC04B, AT24MAC402, AT24C16D, 25CSM04, AT93C86A, AT93C46D, AT24C02D and AT24C64D device families available in 8L SOIC and TSSOP (3.90mm and 4.4mm) packages.Reason for Change: To improve manufacturability by implementing new packing materials and packing changes.Estimated First Ship Date: 17 July 2026 (date code: 2629)
Description of Change:Implementation of Inner Box, Reel and MSL Bag Label changes for virtually ALL Microchip products.Reason for Change:To improve productivity by implementing inner box, reel and MSL bag label changes.
Description of Change:Qualification of Microchip Technology Gresham ? Fab 4 (GRTM) as an additional fabrication site for selected ATECC508A, ATECC608B, and ATECC608A device families available in various packages.Reason for Change:To improve on-time delivery performance by qualifying Microchip Technology Gresham ? Fab 4 (GRTM) as an additional fabrication site.
Description of Change:Qualification of a new lead frame design for selected ATECC608B, ATSHA204A, ATECC508A, ATECC608A and ATECC108A device families available in 8L SOIC (3.90mm) package assembled at MTAI assembly site.Reason for Change:To improve productivity by qualifying new lead frame design.
Revision History:June 24, 2022: Issued initial notification.October 27, 2022: Issued final notification. Updated affected CPN list to include catalog part numbers (CPN) released prior issuance of the Final PCN. Attached the qualification report and added estimated first ship date by November 04, 2022Description of Change:Qualification of MTAI as an additional final test site for selected ATECC108A-SSxxx-x, ATECC508A-SSxxx-x, ATECC608A-SSxxx-x, ATECC608B-SSxxx-x and ATSHA204A-SSxxx-x device families available in 8L SOIC (3.90mm) package.Reason for Change:To improve manufacturability by qualifying MTAI as an additional final test site.
Cancellation Notification: (Previously Issued under Future PCN 90029)Revision History:May 11, 2022: Issued initial notification. November 09, 2022: Issued cancellation notificationDescription of Change:This qualification was originally performed to qualify MTAI as an additional assembly site for selected ATECC108A, ATECC508A, ATSHA204A, ATECC608A, ATECC608B and ECC608-TFLXWPC device families available in 8L SOIC (3.90mm) package. Reason for Change:Microchip has decided to not qualify MTAI as an additional assembly site for selected
Revision History:September 13, 2022: Issued initial notification.October 18, 2022: Issued final notification. Attached the Qualification Report. Revised the Impact to datasheet from Yes to None. Revised the ASSH plant name from ASE Advanced Semiconductor (Shanghai) Co., Ltd. to ATX Semiconductor (Shanghai)Co., Ltd. Provided estimated first ship date to be on October 31, 2022.Description of Change:Qualification of MTAI as an additional assembly site for selected ATECC108A, ATECC508A, ATSHA204A, ATECC608A, ATECC608B and ECC608-TFLXWPC device families available in 8L SOIC (3.90mm) package using QMI519 die attach material.Pre and Post Change Summary: : see attachedImpacts to Data Sheet:NoneChange ImpactNoneReason for Change:To improve on-time delivery performance by qualifying MTAI as an additional assembly.Change Implementation Status:In ProgressEstimated First Ship Date:October 31, 2022 (date code: 2245)Note: Please be advised that after the estimated first ship date customers may receive pre and post change parts.Time Table Summary:: see attached
Description of Change:Qualification of MTAI as an additional assembly site for selected ATECC108A, ATECC508A, ATSHA204A, ATECC608A, ATECC608B and ECC608-TFLXWPC device families available in 8L SOIC (3.90mm) package using QMI519 die attach material.Reason for Change:To improve on-time delivery performance by qualifying MTAI as an additional assembly.
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