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24LC64T-I/MS
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2500 par Reel
MSOP-8
Surface Mount
Informations de livraison:
Code HTS:
ECCN:
Informations PCN:
Product Category: MemoryNotification Subject: CCB 7788.001 Final Notice: Qualification of palladium coated copper with gold flash (CuPdAu) as a new bond wire material for 24CS64, 24CS32, 24AA64, 24FC64, 24LC32AF, 24LC64, 24AA32AF, 24LC32A, 24AA32A, 24AA64F, 24LC64F, 24FC64F, 24LC128, 24FC128, 24AA128, 24CS128, 24CS256, 24LC256, 24AA256, 24FC256, 24CS512, 24CSM01 and 25CSM01 device families available in 8L MSOP (3x3mm) package at MTAI assembly site.Description of Change: Qualification of palladium coated copper with gold flash (CuPdAu) as a new bond wire material for 24CS64, 24CS32, 24AA64, 24FC64, 24LC32AF, 24LC64, 24AA32AF, 24LC32A, 24AA32A, 24AA64F, 24LC64F, 24FC64F, 24LC128, 24FC128, 24AA128, 24CS128, 24CS256, 24LC256, 24AA256, 24FC256, 24CS512, 24CSM01 and 25CSM01 device families available in 8L MSOP (3x3mm) package at MTAI assembly site.Pre and Post Summary Changes: See attached SPCN document for more detailsReason for Change: To improve manufacturability by qualifying palladium coated copper with gold flash (CuPdAu) as a new bond wire material.Estimated First Ship Date: 14 September 2026 (date code: 2638)
Description of Change:Implementation of Inner Box, Reel and MSL Bag Label changes for virtually ALL Microchip products.Reason for Change:To improve productivity by implementing inner box, reel and MSL bag label changes.
Description of Change: Qualification of of U08D as a new fabrication site for selected products of the 24AA32A, 24AA32AF, 24LC32A, 24LC32AF, 24AA64, 24AA64F, 24FC64, 24FC64F, 24LC64, 24LC64F, AT24C32D, AT24C32E, AT24C64D and AT24C64B device families.Reason for Change: To improve manufacturability and on-time delivery performance by qualifying U08D as a new fabrication location.Estimated First Ship Date: 23 April 2025 (date code: 2517)Revision History:February 7, 2025: Issued initial notification.March 26, 2025: Issued final notification. Attached the Qualification Report. Provided Estimated First Ship Date on April 23, 2025.
PCN Status:Initial NotificationDescription of Change:Qualification of of U08D as a new fabrication site for selected products of the 24AA32A, 24AA32AF, 24LC32A, 24LC32AF, 24AA64, 24AA64F, 24FC64, 24FC64F, 24LC64, 24LC64F, AT24C32D, AT24C32E, AT24C64D and AT24C64B device families.Reason for Change:To improve manufacturability and on-time delivery performance by qualifying U08D as a new fabrication location.
Description of Change:1. Updated TABLE 1-1: DC CHARACTERISTICS.2. Editorial updates throughout document.Reason for Change: To improve productivity.
Statut du produit:
The 24LC64 series of 64 Kbit electrically Erasable PROM is organized as a single block of 8 K x 8-bit memory with a 2-wire serial interface. Low-voltage design permits operation down to 2.5 V, with standby and active currents of only 1 µA and 1 mA, respectively. It has been developed for advanced, lowpower applications such as personal communications or data acquisition.
The 24LC64 also has a page write capability for up to 32 bytes of data. Functional address lines allow up to eight devices on the same bus, for up to 512 Kbits address space. The 24LC64 is available in the standard 8-pin PDIP, surface mount SOIC, TSSOP, DFN, TDFN and MSOP packages. The 24LC64 is also available in the 5-lead SOT-23 package.
Features:
Learn more about the 24LC64 family of EEPROM
Stock conservé dans l'entrepôt du fabricant. Sous réserve de disponibilité et de temps de transit.